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Market Research Reports

FPC & Rigid-flex PCB Report 2024

Publication Date: May 7, 2024
  • Focal points of this report
1. Industry Trends and Market Size Forecast (2023)
2. Technology Trends in Application
3. Market Trends for High-Speed/High-Frequency FPCs
4. Trends in FPC Usage and Analysis
5. Supply Chain Analysis
6. Multi-Layer & Rigid-Flex PCB Analysis
7. Initiatives by Major Companies

  • Table of contents
Executive Summary 
Chapter 1, Market by Type for FPC & Rigid-Flex Boards 
Chapter 2, Trends in High-Frequency FPC & Rigid-Flex Boards 
Chapter 3, Market by Application for FPC & Rigid-Flex Boards 
Chapter 4, Market Size Forecast for FPC & Rigid-Flex Boards 
Chapter 5, Case Studies 

Power Module Report -2023-

Publication Date: April 10, 2024
~Trends in IGBT and SiC power modules~
  • Focal points of this report
1. Market Trends and manufacturer trends of IGBT /SiC power modules 
  - Classified by module capacity, by application, by insulating substrate material, by package type 
2. The updated comparison tables of product lineup of major 25 module companies 
  - Classified by module capacity, by type of circuit, by PKG type, by PM / IPM, of IGBT and SiC modules

  • Table of contents
Chapter 1, Executive Summary 
Chapter 2, Trends of power module products and the technologies 
Chapter 3, Market trends of power modules 
Chapter 4, Trends of applications

IC Package/Substrate Report

Publication Date: March 31, 2024
~ Advanced IC Substrates (Flip Chip substrates/ 2.x D Interposer) ~
~ Study of Market & Technology trends ~
  • Focal points of this report
- Study of IC substrates and related semiconductor package technology, electronic materials 
- Market and Technology analysis for IC substrates by key applications: 
   (Processors for Server/Mobile SOC/Processors for PC/Memory IC) 
- Market size forecast through 2023, based on volume & value 
- Manufacturers share based on volume & value 
- Case study of IC substrate manufacturers: 14 companies

  • Table of contents
Chapter 1 Market and Technology Trends for IC Package/Substrate
Chapter 2 Market trend for IC Substrate & related material
Chapter 3 Case studies of IC Substrate makers

Technology & Market Trends Report on FC-BGA Substrates 2023

Publication Date: November 20, 2023
~ Analyzing the Technology & Market Trends of Flip Chip-Ball Grid Array Substrates ~ 
  • Focal points of this report
* Technology Trends of the Advanced IC Packages (for HPC) 
* Market Trends for the Flip Chip-Ball Grid Array (FC-BGA) Substrates 
* Case studies of the global key substrate manufacturers

  • Table of contents
Chapter 1 Executive Summary 
Chapter 2 Technology Trends of Advanced IC Packages 
Chapter 3 Global Market Trends of FC-BGA Substrates 
Chapter 4 Case Studies of Major Substrate Manufacturers

Technology & Market Trends Report on EMI Shielding Film 2023

Publication Date: September 19, 2023
~ Market Analysis of Electro Magnetic Interference Shielding Film for Electronic Circuits and Devices ~
  • Focal points of this report
 * Global market size of Electro Magnetic Interference (EMI) shielding film (Y2022)
 * Market size and forecasts for EMI shielding films (Y2021-2032)
 * EMI shielding film manufacturers' entry products, business trends, development trends, supply relations, etc.
 * Trend of application (Adoption trend, technology & market trends, etc.)
 * Manufacturers' Case Studies of EMI shielding film (7 companies)

  • Table of contents
Summary
Chapter 1, Technology and Market Trend of EMI Shielding Film
Chapter 2, Trends of Applications
Chapter 3, Manufacturers’ Case Studies

CCL Report 2023

Publication Date: August 28, 2023
~ Analyzing the Global Market Trends of Copper Clad Laminates and Movements in the promising fields ~
  • Focal points of this report
* Analysis of the global market overview of Copper Clad Laminate (CCLs) in 2022 through conducting a detailed investigation into the trends of key suppliers and forecasting the market size by product types and applications up until 2032. 
* Analysis of the market share, production sites, and production capacity of the major 37 companies including Kingboard, SYTECH, Nan Ya Plastics from China, Taiwan, Japan, South Korea, and Western countries. 
* Analysis of the movements of CCLs in promising fields, including CCLs for IC substrate and automotive applications, as well as Low Loss CCLs for HSDs and antennas.

  • Table of contents
Market Overview
Chapter I Market Overview
Chapter II Movements of the CCLs in the promising fields
Chapter III Manufacturers’ case studies

Advanced Packaging and Materials in the Chiplet Era

Publication Date: May 31, 2023
~ Trends in 2.xD packages, Redistribution layer dielectric materials and the Encapsulants ~ 
  • Focal points of this report
 * Trends of Chiplet PKG 
   1. Chipletization of Major ICs and Trends in Advanced PKG Technology 
   2. Diversification of 2.xD PKGs and application of fan-out PKG technology
   3. Chiplet PKG technology trends of major IC/foundries/assembly companies 
 * Trends of major PKG materials 
   1. RDL Dielectric materials
   2. Encapsulants for wafer/panel base assembly

  • Table of contents
Chapter 1, Executive Summary
Chapter 2, Trends of Miniaturization of IC Manufacturing Technology and Chipletization
Chapter 3, Chiplet Integration package trends
Chapter 4, Trends of main IC packaging materials
Chapter 5, Case studies of assembly material suppliers

PCB Report 2023

Publication Date: May 15, 2023
~ Analyzing the Global Market Trends of Printed Circuit Boards ~
  • Focal points of this report
*Global Printed Circuit Board (PCB) market in 2022 and forecast of the market size 2022-2032 by types and applications 
*Global major 45 PCB manufacturers by types and applications
*Global major PCB materials manufacturers 2020-2022 and forecast of the market size 2022-2032
*Case studies of major 45 PCB manufacturers

  • Table of contents
Chapter 1 Executive Summary
Chapter 2 Trends in the PCB Market
Chapter 3 Manufacturers’ Case Studies

FCCL Report 2023

Publication Date: May 12, 2023
  • Focal points of this report
 * Market size forecast of FPC materials by application & type 
 * Analysis of FPC materials
 * Case Study of Major FCCL Manufacturers

  • Table of contents
Executive Summary
Chapter 1, FPC material overall market
Chapter 2, FCCL for high speed and high frequency
Chapter 3, Market of Film
Chapter 4, Analysis of 2-layer FCCL market
Chapter 5, Analysis of 3-layer FCCL market
Chapter 6, Coverlay market
Chapter 7, Interlayer dielectric materials market
Chapter 8, Case study

Technology & Market Trends Report on FC-BGA Substrates/2.xD PKG Substrates -2022-

Publication Date: December 15, 2022
  • Focal points of this report
* Supply and demand trends of this promise market. 
* Advanced IC package technology trends by ICs and major manufacturers. 
* Global market size of the Flip Chip-Ball Grid Array (FC-BGA) substrates/2.xD Package substrates. 
* Actual sales of major substrate manufacturers. 
* Supply state to major semiconductor manufacturers. 
* Case studies of major substrate manufacturers.

  • Table of contents
Summary
Chapter 1 Technology Trends of the Advanced IC Package
Chapter 2 Global Market Trends for FC-BGA Substrates/2.xD Package Substrates
Chapter 3 Case Studies of Major Substrate Manufacturers

FPC & Rigid-flex PCB Report 2022

FPC & Rigid-flex PCB Report 2022
Publication Date: August 9, 2022
  • Focal points of this report
・FPC & Rigid-flex PCB trends by manufacturer and market size forecast (2021) 
・Analysis of technology trends in application
・Market trends for high-speed/high-frequency FPCs for 5G mobile devices  
・Trends of FPC usages and decomposition iPhone and Galaxy and Xperia and Huawei, and Vivo 
・Supply chain 
・Analysis and prediction of multi-layer & Rigid-flex PCB by layer-count 
・Analysis of the status of initiatives by major companies

  • Table of contents
Executive Summary
Chapter 1 Type of FPC & Rigid-Flex PCB Market
Chapter 2 Trend of high frequency of FPC & Rigid-flex
Chapter 3 Market of FPC & Rigid-Flex PCB by Application
Chapter 4 FPC Market Size Forecast
Chapter 5 Case Study

Market Report on High Frequency PCB & PCB Material for Automotive Radar

Market Report on High Frequency PCB & PCB Material for Automotive Radar
Publication Date: July 19, 2022
~ Market Analysis of High Frequency Printed Circuit Boards and Their Materials, Such as Copper Clad Laminate and Prepreg, for Automotive Radar ~
  • Focal points of this report
1. The adoption status of automotive millimeter wave radars and the global market for automotive millimeter wave radars. 
2. Manufacturers and their business trends of high frequency PCB for automotive millimeter wave radar.
3. Manufacturers’ business trends of high frequency PCB material for automotive millimeter wave radar.
4. Technical trends, supply relations, price trends, ... of high frequency PCB / PCB materials. 
5. Company case studies of major high frequency PCB manufacturers / PCB material manufacturers.

  • Table of contents
Summary
Chapter 1 Market Trends for High Frequency PCB Materials for Automotive Radar
Chapter 2 Technology and Market Trends for Automotive Radar
Chapter 3 Market Trends of High Frequency PCBs for Automotive Radar
Chapter 4 Trends of applications 
Appendix: Specifications and Characteristics Table of Major High Frequency PCB Materials for Automotive Radar

Copper Foil Market Report 2022

Copper Foil Market Report 2022
Publication Date: April 21, 2022
  • Focal points of this report
1. Global Copper Foil market size and major manufacturers' market share by application and thickness
2. Global market size forecast on Copper Foil for PCB by application and thickness
3. Technology & Market trends on Ultra-thin copper foil by application and thickness
4. Technology & Market trends on Low profile copper foil by application and roughness
5. Case studies on major manufacturers (19 companies)

  • Table of contents
General Outline
Chapter I Global Copper Foil Market Trends
Chapter II Copper Foil Trends in Focused Fields-Ultra-thin Copper Foil-
Chapter II Copper Foil Trends in the focusing fields-Low Profile Copper Foil-
Chapter III Manufacturers Case Studies

Power Module & Ceramic Substrate Report 2021

Power Module & Ceramic Substrate Report 2021
Publication Date: November 22, 2021
~ A report that adds the latest data on ceramic substrates to the "Power Module Report" ~
  • Focal points of this report
* Market Trends and manufacturer trends of IGBT /SiC power modules
* The updated comparison tables of product lineup situation of major 23 power module companies
* Analysis of ceramic substrate market and corporate trends

  • Table of contents
Chapter 1 Executive Summary 
Chapter 2 Trends of power module products and the technologies
Chapter 3 Market trends of power modules 
Chapter 4 Trends of applications 
Chapter 5 Market trends of Ceramic substrate for power devices

Solder Resist Report 2021

Solder Resist Report 2021
Publication Date: November 12, 2021
  • Focal points of this report
*General outline of the global Solder Resist market 
*Global Solder Resist market size in 2020 and forecast (-2030) by Types & Applications 
*Actual sales of the major Solder Resist Manufacturers by Types & Applications 
*Case studies 
   - Japanese Manufacturers 
   - European & American Manufacturers 
   - Chinese & Taiwanese Manufacturers

  • Table of contents
Outline
I. Trends of the Global Solder Resist Market
II. Global Solder Resist Market Size Forecast
III. Case Studies

Market Report on High Speed / High frequency PCB Materials for Mobile

Publication Date: August 31, 2021
  • Focal points of this report
*Analysis of Market and technology trend for 5G mobile terminals, high speed / high frequency PCB (and FPC), and low Df type PCB materials (CCL/Prepreg and FCCL)
*Technology trend of high speed / high frequency PCB (and FPC) for each application.
*Market size and market forecast of high speed / high frequency PCB (and FPC) 
*Market size and market forecast of high speed / high frequency CCL/Prepreg (and FCCL) for mobile.
*Market trend of film in FPC 
*Market trend of high speed / high frequency adhesive sheet
 
  • Table of contents
Chapter 1, Summary
Chapter 2, Market trend for high speed / high frequency PCB and CCL / PP
Chapter 3, Trend of high-frequency FPC for mobile
Chapter 4, Market trends High Speed / High frequency film and FCCL for FPC

Power Module Report 2020

Publication Date: December 23, 2020
~ Technology and market trends of Power modules by device and package technology ~ 
  • Focal points of this report
* Market Trends and manufacturer trends of IGBT /SiC power modules
* The updated comparison tables of product lineup situation of major 23 power module companies
* Package technology trends mainly oriented towards xEV drive
 
  • Table of contents
Chapter 1, Executive Summary
Chapter 2, Trends of power module products and the technologies
Chapter 3, Market trends of power modules
Chapter 4, Trends of applications

CCL Report 2020

Publication Date: November 10, 2020
  • the Purpose of Publication
This report is issued to provide basic information on Copper Clad Laminate (CCL) material to relevant companies to help them making their technical and/or marketing strategies for the market based on survey and analysis of the global trends of the product.
 
  • Table of contents
General Outline
I   Market Overview
II  Sales status of major CCL manufacturers
III Global CCL market size forecast
IV Trends of CCL in the Promising Fields
Case Studies

Trends of Advanced IC packages in Data Center Era and the materials

Publication Date: November 5, 2020
~ Trends of Fan out Wafer lever package/Panel level package, 2.5D package, the encapsulants and Redistribution layer dielectric materials ~
  • Focal points of this report
* Trends of Heterogeneous Integration PKG
  1. Trends of CPU/GPU/FPGA PKG for Data center
  2. Technology trends of Advanced PKG
* Trends of main materials for IC PKG
  1. Dielectric materials for RDL:
  2. Encapsulants for wafer/panel base assembly
 
  • Table of contents
Chapter 1 Executive Summary
Chapter 2 Trends of ICs for Data Center
Chapter 3 Trends of Heterogeneous Integration packages
Chapter 4 Trends of main packaging materials
Chapter 5 Case studies of material manufacturers

MSAP PCB & ETS Report 2020

MSAP2020
Publication Date: August 31, 2020
  • the Purpose of Publication
This report is prepared to provide industry-related people with basic information on marketing and technological trends in the global market of MSAP PCBs & ETSes.
 
  • Table of contents
Chapter 1 the Global Market of MSAP PCBs and ETSes
Chapter 2 the Global Market of SLPs
Chapter 3 the Global Market of MSAP-Utilized Substrates for High Frequency Modules
Chapter 4 the Global Market of MSAP-Utilized Substrates and ETS-Utilized Substrates for FC-CSPs
Chapter 5 the Global Market of SiPs
Chapter 6 the Global Market of Ultra-Thin Copper Foil with Carrier Foil
Chapter 7 the Global Market of CCL and Prepreg for MSAP PCBs and ETSes
Chapter 8 Case Studies

PCB Report 2020

Publication Date: June 30, 2020
  • Focal points of the survey
*General outline of the global PCB market
*PCB market size in 2019 and forecast(-2029) by types & applications
*PCB Materials
*PCB Manufacturing Equipment
*Case studies
 
  • Table of contents
*A General Outline of the Global PCB Market
*Chapter 1 PCB Market
*Chapter 2 PCB Materials
*Chapter 3 PCB Manufacturing Equipment
*Chapter 4 PCB Manufacturers Case Studies

FCCL Report 2020

Publication Date: April 21, 2020
  • Focal points of the survey
*Market size forecast of FPC materials by application & type (-2024)
*Analysis of FPC materials
*Market trend by FCCL application field
*Case Study of Major FCCL Manufacturers
 
  • Table of contents
*Executive Summary
*Chapter 1, FPC material overall market
*Chapter 2, Market of Film
*Chapter 3, Analysis of 2-layer FCCL market
*Chapter 4, Analysis of 3-layer FCCL market
*Chapter 5, Coverlay market
*Chapter 6, Interlayer dielectric materials market
*Chapter 7, Case study

Market Research on Thermal Interface Material & Thermally Conductive Filler 2020

Publication Date: March 31, 2020
  • Focal points of the survey
1. Market size (2018 and 2019) and market forecast of the Thermal Interface Material by form, application and thermal conductivity (2018 to 2030)
2. Manufacturers' share of TIM (2018 and 2019)
3. Market size (2018 and 2019) and market forecast of the thermally conductive fillers as Alumina, Aluminum nitride and Boron nitride by form and particle size (2018 to 2030)
4. Application trends
- Automotive, Power module and 5G Base station
5. Case study of major TIM manufacturers and major thermally conductive filler manufacturers (14 companies)

IC Package Substrate Report 2019

Publication Date: December 3, 2019
  • Table of Contents
*Chapter 1 Summary
*Chapter 2 FCBGA Substrates
*Chapter 3 FCCSP Substrates
*Chapter 4 Case Studies

Market Research on Power Control Unit for EV

Publication Date: September 27, 2019
  • Focal points of the survey
* Forecast of market size and changes of the heat dissipation and cooling types of PCU (2017 to 2030)
* List of the numbers of motors and others, and heat dissipation and cooling technologies of major EV manufacturers and major EV models
* Supply chain relationship for each major EV
* Technology trends
  - Electro-mechanical integration and Electric drive system
  - SiC semiconductor introduction
  - Integration and simplification of cooling system
* Case study of major EV manufacturers and major electric parts manufacturers (11 companies)

Fan-Out-Panel-Level Package Report 2019

Publication Date: July 31, 2019
  • the Purpose of Publication
To Provide Basic Information on the Global Fan-Out-Panel-Level Package Industry.
 
  • Table of contents
[Preliminary Chapter]
  Preliminary Items
[Body Chapter]
  the Global Markets of FO-PLPs and Related Things

The Market and Technological Trend for High-frequency Film

Publication Date: July 17, 2019
  • Outline of the Report
*Trend of high-frequency films and base material by resin system
(LCP and High frequency polyimide film, Other high-frequency resin films, High-frequency adhesive materials )
*Trends of high-frequency film and base material by application
(Mobile phones and smartphones, Base stations of 5G network, Millimeter wave radar)
*Case Studies
 
  • Table of contents
*Summary
*Chapter 1 Trend of high-frequency films and base material by resin system
*Chapter 2 Trends of high-frequency film and base material by application
*Chapter 3 Corporate case studies
*Appendix: High frequency film/FCCL/resin (Characteristic data table)

Substrate-Like PCB Report 2018

Publication Date:January 16, 2018
  • Outline of the Report
*the Definition of an SLP & Related Things
*the Global Market of SLPs & Related Things
*Materials for SLPs and Related-Things
*Case Studies
         
  • Table of contents
*Preliminary Chapter the Definition of an SLP & Related Things
*Chapter One the Global Market of SLPs & Related Things
*Chapter Two Materials for SLPs and Related-Things
*Chapter Three Case Studies

Power Modules & Component Materials 2017

Publication Date:December 15, 2017
  • Outline of the Report
*Power Modules
  1. Market Trends of IGBT power module and SiC power module
  2. Core technology trends for high reliability of modules
*Module component materials
  1. Ceramic substrate
  2. Sinter joining material
 
  • Table of contents
*Chapter 1 Executive Summary
*Chapter 2 Trends of power modules
*Chapter 3 Trends of main components
*Chapter 4 Trends of applications

FO-WLP & Encapsulant Report

Publication Date:January 25, 2017
  • Outline of the Report
* FO-WLP
1. Driver of Market expansion
2. Technical issues for cost reduction and market expansion
* Encapsulation and material
1. Market trends of encapsulants for FO-WLP
2. Technical trends of encapsulation for FO-WLP
 
  • Table of contents
- Chapter 1 Executive Summary
- Chapter 2 Trends of FO-WLP
- Chapter 3 Trend of encapsulation technology and material

FO-WLP and RDL Dielectric Material

Publication Date:February 29, 2016
*Outline of the Report
- FO-WLP
1. Main driver of Market growth
2. Technical issues for cost reduction and market expansion
- Dielectric material
1. Market growth of dielectric material
2. Technical demands of RDL dielectric materials for FO-WLP
         
*Table of contents
- Chapter 1, Executive Summary
- Chapter 2, Trends of FO-WLP
- Chapter 3, Trends of redistribution dielectric materials

PCB Report 2015

Publication Date:December 18, 2015
Price:JPY210,000
  • Outline of the Report
      -     Global PCB Market
Outline
Market Size & Forecast
PCB Materials
PCB Manufacturing Equipment
Case Studies
         
  • Table of contents
-     A General Outline of the Global PCB Market
-   Chapter 1 Global PCB Market Size & Forecast
-   Chapter 2 PCB Materials
-   Chapter 3 PCB Manufacturing Equipment
-   Chapter 4 PCB Manufacturers Case Studies

FPC & FCCL Outlook Report

Publication Date:November 10, 2015
  • Outline of the Report
This is a condensed version of two of our marketing research reports, namely, "FPC & Rigid-Flex PCB Report" and "FCCL Report".
*The figures in the report are based on Year 2013 data.
a) the global FPC market
b) the global Rigid-Flex PCB market
c) the global coverlay market
d) the global bonding sheet market
e) the global prepreg market
 
  • Table of contents
-   Summary
-   Market trend of FPC
-  Market trend of FCCL
-   reference data

Build-Up PCB Report 2014

Publication Date:March 26, 2015
  • Outline of the Report
-   The Global Printed Circuit Board Markets, Size and Forecast
-   Major Manufacturers' Share of the Global Printed Circuit Board Markets
-   The Global Build-Up PCB Markets, Size and Forecast
-   20 Largest Manufacturers' Share of the Global Build-Up PCB Markets
-   Application Fields of Printed Circuit Boards
-   Case Studies
         
  • Table of contents
-   Chapter 1 The Global Printed Circuit Board Markets, Size and Forecast
-   Chapter 2 Major Manufacturers' Share of the Global Printed Circuit Board Markets
-  Chapter 3 The Global Build-Up PCB Markets, Size and Forecast
-   Chapter 4 20 Largest Manufacturers' Share of the Global Build-Up PCB Markets
-   Chapter 5 Application Fields of Printed Circuit Boards
-     Chapter 6 Case Studies      
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