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IC Package Substrate Report 2019

ICPKG2019
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Table of Contents

Chapter 1 Summary
- Market Size Forecast of IC Package Substrates (2015-2028)
- Market Size Forecast of Flip Chip Substrates (2015-2028)
- Actual Sales of Major IC Substrate Manufacturers in 2018
 
Chapter 2 FCBGA Substrates
- Overall Market of FCBGA Substrates in 2018
- Market Size of FCBGA Substrates by Applications/Layer Counts in 2018
- Market Size of FCBGA Substrates by Applications in 2018
- Market Size of FCBGA Substrates by Layer Counts in 2018
- Market Size of FCBGA Substrates in Application Fields
     by Manufactures/Layer Counts in 2018
- Actual Sales of Major Manufactures by Applications/Layer Counts in 2018
- Market Size Forecast of FCBGA Substrates by Applications (2015-2028)
- Market Size Forecast of FCBGA Substrates by Layer Counts (2015-2028)
- Market Size Forecast of FCBGA Substrates in Application Fields
  by Layer Counts (2015-2028)
 
Chapter 3 FCCSP Substrates
- Overall Market of FCCSP Substrates in 2018
- Market Share of Major Manufacturers by PKG Types in 2018
- Actual Sales of Major Manufacturers in 2018
- Market Size Forecast of FCCSP Substrates (2015-2028)
 
Chapter 4 Case Studies
*Japanese Manufacturers
1. Ibiden Co., Ltd.
2. SHINKO ELECTRIC INDUSTRIES CO., LTD.
3. KYOCERA Corporation
4. Toppan Printing Co., LTD
 
*Taiwanese Korean and Other Manufacturers
1. Unimicron Technology Corporation
2. Nan Ya Printed Circuit Board Corporation
3. Kinsus Interconnect Technology Corporation
4. Samsung Electro-Mechanics Company Limited
5. AT&S Austria Technologie & Systemtechnik AG
 
   **Survey items**
   1. Company Profile
   2. IC Package Substrate Business
    2-1. Manufacturing Sites
    2-2. Major Products
    2-3. Actual Sales of IC Package Substrates
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