Technology & Market Trends Report on FC-BGA Substrates/2.xD PKG Substrates 2022
Date | Published on December 15, 2022 |
Contract & Price | Corporate contract: JPY660,000- * *This contract allows for use within the purchasing company / organization. Global contract: JPY880,000- ** **This contract allows for use within the purchasing company / organization and the subsidiaries with a 51% stake or more. We (JMS) hold the copyright on this report in any contract. |
Size / Format | A4 x 307 pages *Hard Copy (Book) + Soft Copy (PDF) *Hard Copy only *Soft Copy only |
 | *Brochure is here |
Focal points of the Report
1. Forecast and analysis the supply and demand trends of this promise market that new manufacturers are constantly entering.
2. Analysis the advanced IC package technology trends by ICs and major manufacturers.
3. Forecast and analysis the global market size of the FC-BGA substrates/2.xD Package substrates by applications and layer counts in value, volume and area terms.
4. Analysis the actual sales of major substrate manufacturers by applications and layer counts in both value and volume terms.
5. Analysis the supply state to major semiconductor manufacturers by applications in both value and volume terms.
6. Case studies of major substrate manufacturers by country/region.
Table of Contents
Summary
Global Market Overview of FC-BGA Substrates/2.xD Package Substrates p2
Demand and Supply Analysis of FC-BGA Substrates/2.xD Package Substrates p4
Global Market Overview of FC-BGA Substrates/2.xD Package Substrates for PC p7
Global Market Overview of FC-BGA Substrates/2.xD Package Substrates for Server/AI p9
Global Market Overview of FC-BGA Substrates/2.xD Package Substrates for Game/Others p11
Global Market Overview of FC-BGA Substrates/2.xD Package Substrates for Networking p13
Global Market Overview of FC-BGA Substrates/2.xD Package Substrates for Automotive p15
Sales Ranking of Major Substrate Manufacturers p17
Supply Ranking to Major Semiconductor Manufacturers p18
Customer Information of FC-BGA Substrates/2.xD Package Substrates for PC p19
Customer Information of FC-BGA Substrates/2.xD Package Substrates for
Server/AI p20
Customer Information of FC-BGA Substrates/2.xD Package Substrates for Game/Others p21
Customer Information of FC-BGA Substrates/2.xD Package Substrates for Networking p22
Customer Information of FC-BGA Substrates/2.xD Package Substrates for Automotive p23
Sales Status of the Major Substrate Manufacturers p24
Capital Investment Movements for FC-BGA Substrates of the Major Substrate Manufacturers p26
Product Trends of FC-BGA Substrates/2.xD Package Substrates p30
Chapter 1 Technology Trends of the Advanced IC Package
1. Miniaturization of Silicon Node p33
2. Packaging Technology Roadmap by ICs p34
3. Types and Outlines of the 2.xD Packages p38
4. Trends of Silicon Interposer(Si-IP) p40
5. Packing Technology Trends of Major Manufacturers p41
Chapter 2 Global Market Trends for FC-BGA Substrates/2.xD Package Substrates
1. Global Market Size Forecast for FC-BGA Substrates/2.xD Package Substrates
Global Market Size Forecast for FC-BGA Substrates/2.xD Package Substrates by Applications p55
Global Market Size Forecast for FC-BGA Substrates/2.xD Package Substrates by Layer Counts p63
2. Global Market Trends by Segments
Global Market Size of FC-BGA Substrates/2.xD Package Substrates by Applications/Layer Counts p72
3. Actual Sales of Major Substrate Manufacturers
Major Substrate Manufacturers’ Actual Sales by Applications p84
Major Substrate Manufacturers’ Actual Sales by Layer Counts p87
Major Substrate Manufacturers’ Actual Sales of PC-MPU Substrates p94
Major Substrate Manufacturers’ Actual Sales of PC-GPU Substrates p97
Major Substrate Manufacturers’ Actual Sales of PC-Chipset Substrates p100
Major Substrate Manufacturers’ Actual Sales of Server/AI-MPU Substrates p103
Major Substrate Manufacturers’ Actual Sales of Server/AI-GPU Substrates p107
Major Substrate Manufacturers’ Actual Sales of Game/Others-MPU Substrates p110
Major Substrate Manufacturers’ Actual Sales of Game/Others-GPU Substrates
p113
Major Substrate Manufacturers’ Actual Sales of Networking-FPGA/ASIC/Others
p116
Major Substrate Manufacturers’ Actual Sales of Automotive-FPGA/ASIC/Others
p119
Major Substrate Manufacturers’ Actual Sales of Others-FPGA/ASIC/Others p122
Major Substrate Manufacturers’ Actual Sales by Supply Chain p125
4. Supply State to Major Semiconductor
Manufacturers p138
Supply State to Intel p143
Supply State to AMD p146
Supply State to Nvidia p149
Supply State to Xilinx p152
Supply State to Broadcom p155
Supply State to Apple p158
Supply State to Marvell p161
Supply State to Renesas p164
Supply State to NXP p167
Supply State to Texas Instruments p170
Supply State to Samsung p173
Supply State to Microchip p176
Supply State to IBM p178
Supply State to Kioxia p180
Supply State to STMicroelectronics p182
Supply State to MediaTek p184
Supply State to Oracle p187
Supply State to Micron p189
Supply State to SK Hynix p191
Supply State to Qualcomm p193
Supply State to Other Semiconductor Manufacturers p195
Chapter 3 Case Studies of Major Substrate Manufacturers
Japanese Manufacturers
IBIDEN CO., LTD. p200
SHINKO ELECTRONIC INDUSTRIES CO., LTD. p207
KYOCERA Corporation p216
TOPPAN INC. p224
Taiwanese Manufacturers
Unimicron Technology Corporation p235
Nan Ya PCB Corporation p244
KINSUS INTERCONNECT TECHNOLOGY CORP. p253
Zhen Ding Technology Holding Limited p260
Korean Manufacturers
Samsung Electro-Mechanics Co., Ltd. p266
SIMMTECH Co., Ltd. p275
KOREA CIRCUIT CO., LTD. p280
DAEDUCK ELECTRONICS Co., Ltd. p286
LG Innotek Co., Ltd. p294
European Manufacturers
AT & S Austria Technologie & Systemtechnik Aktiengesellschaft p299
