Advanced Packaging and Materials in the Chiplet Era
~ Trends in 2.xD packages, Redistribution layer dielectric materials and the Encapsulants ~
Date | Published on May 31, 2023 |
Contract & Price | Corporate contract: JPY660,000- * *This contract allows for use within the purchasing company / organization. Global contract: JPY880,000- ** **This contract allows for use within the purchasing company / organization and the subsidiaries with a 51% stake or more. We (JMS) hold the copyright on this report in any contract. |
Size / Format | A4 x 294 pages You can choose from the following three patterns: *Hard copy (Book) + Soft copy (PDF) **Hard copy Only ***Soft copy Only |
 | *Brochure is here |
Focal points of the Report
* Trends of Chiplet PKG
1. Chipletization of Major ICs and Trends in Advanced PKG Technology
2. Diversification of 2.xD PKGs and application of fan-out PKG technology
- Si interposer (IP) alternatives: RDL-IP, Si-Bridge, Glass-IP
- Larger IP/PKG, 3D IC, fine pitch bonding and hybrid bonding
3. Chiplet PKG technology trends of major IC/foundries/assembly companies
* Trends of major PKG materials
1. RDL Dielectric materials:
- Shift from Si-IP (2.5D) to RDL-IP (2.3D PKG), Size expansion of IP/PKG size
- Market trends by application, type of photosensitivity, type of polymer
2. Encapsulants for wafer/panel base assembly
- Adoption of wafer level MUF, competition with liquid materials/granules, etc.
- Market trends by material form, PKG type, and wafer/panel assembly
Table of Contents
Chapter 1, Executive Summary
1. Chiplet Package Market Trends /2
2. Fan-out Package Market Trends /12
3. Company status of Chiplet package market entry /17
4. Technology roadmap /19
5. Market trends of Dielectric materials /22
6. Market trends of Encapsulants /30
Chapter 2, Trends of Miniaturization of IC Manufacturing Technology and Chipletization
1. Silicon process miniaturization roadmap /38
2. IC for server / HPC
2.1 Key ICs in data centers /39
2.2 Market entry status by major IC /40
2.3 List of products by main IC /41
3. Product trends of major xPU companies /42
4. Other ICs for HPC/high
end server /57
Chapter 3, Chiplet Integration package trends
A. Technology trends
1. Outline of Chiplet / IC integration technology /63
2. 2.5D system type package /67
3. 3D system type package /71
4. Fan out PKG /74
5. Fine pitch interconnection technology /83
6. PKG technology trends of major assemblers /89
TSMC, Intel, Samsung, Amkor, IBM, AOI, Shinko
B. Market trends
1. Market entry status of major assembly companies
1.1 Wafer/panel based advanced package /112
1.2 2.5D system type package /113
1.3 3D IC package /115
1.4 Fan out PKG /116
1.5 FO PLP /118
2. Market size forecast of 2.5D system type packages
2.1 By IC type /119
2.2 By PKG type /121
2.3 By number of mounted HBM /125
2.4 By reticle size of IP /127
3. Market size forecast of Fan out packages
3.1 By PKG type /131
3.2 By RDL count /135
3.3 By Assembly base shape /137
Chapter 4, Trends of main IC packaging materials
A. RDL Dielectric materials
1. Outline of Dielectric materials /145
2. Required characteristics of Dielectric materials /149
3. Applications for RDL and structure formation /151
4. Market entry status of Dielectric material suppliers /154
5. Product characteristic of Dielectric materials /163
6. Trends of market and manufacturers
6.1 Market size in 2021 and the breakdowns
1) Application x Photosensitive type /167
2) Application x Polymer type /172
6.2 Sales status of major dielectric material manufacturers
1) By Photosensitive type of Total market /177
2) By Polymer type of Total market /180
3) By Application of Total market /183
4) Market for Buffer coat /185
5) Market for RDL /187
6), 7) Market for Fan out/2.5D system type PKG /189
6.3 Market size forecast
1) By Photosensitive type of Total market /192
2) By Polymer type of Total market /194
3) By Application of Total market /196
4), 5) Market for Buffer coat /198
6) Market for RDL /202
7), 8) Market for Fan out/2.5D system type PKG /204
B. Wafer/panel base encapsulant
1. Outline of encapsulation technologies and materials /209
2. Adoption trend of encapsulation technology for Chiplet PKG /217
3. Other applications of sheet encapsulant /223
4. Major suppliers' market entry status and material characteristics /225
5. Trends of market and manufacturers
5.1 Market size and breakdowns in 2021 /231
5.2 Sales status of major encapsulant manufacturers
1) By type of Total market /233
2) By PKG type of Liquid market /235
3) By PKG type of Granule market /237
5.3 Market size forecast
1) By type of Total market /238
2) By PKG type of Total market /240
3) By PKG type of Liquid market /243
4) By PKG type of Granule market /245
5) By type of MUF market /247
Chapter 5, Case studies of assembly material suppliers
Ajinomoto Fine Techno /250
Asahi Kasei /254
Fujifilm Electronic Materials /259
HD MicroSystems /264
Nagase ChemteX /269
Namics /273
Resonac /276
Sanyu Rec /279
Sumitomo Bakelite /282
Toray Industries /288
