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Advanced Packaging and Materials in the Chiplet Era

~ Trends in 2.xD packages, Redistribution layer dielectric materials and the Encapsulants ~

Focal points of the Report

* Trends of Chiplet PKG
1. Chipletization of Major ICs and Trends in Advanced PKG Technology 
2. Diversification of 2.xD PKGs and application of fan-out PKG technology
   - Si interposer (IP) alternatives: RDL-IP, Si-Bridge, Glass-IP
   - Larger IP/PKG, 3D IC, fine pitch bonding and hybrid bonding 
3. Chiplet PKG technology trends of major IC/foundries/assembly companies

* Trends of major PKG materials
1. RDL Dielectric materials:
   - Shift from Si-IP (2.5D) to RDL-IP (2.3D PKG), Size expansion of IP/PKG size
   - Market trends by application, type of photosensitivity, type of polymer
2. Encapsulants for wafer/panel base assembly
   - Adoption of wafer level MUF, competition with liquid materials/granules, etc.
   - Market trends by material form, PKG type, and wafer/panel assembly

Table of Contents

Chapter 1, Executive Summary

1. Chiplet Package Market Trends /2
2. Fan-out Package Market Trends /12
3. Company status of Chiplet package market entry /17
4. Technology roadmap /19
5. Market trends of Dielectric materials /22
6. Market trends of Encapsulants /30

Chapter 2, Trends of Miniaturization of IC Manufacturing Technology and Chipletization

1. Silicon process miniaturization roadmap /38
2. IC for server / HPC
  2.1 Key ICs in data centers /39
  2.2 Market entry status by major IC /40
  2.3 List of products by main IC /41
3. Product trends of major xPU companies /42
4. Other ICs for HPC/high end server /57

Chapter 3, Chiplet Integration package trends

A. Technology trends
1. Outline of Chiplet / IC integration technology /63
2. 2.5D system type package /67
3. 3D system type package /71
4. Fan out PKG /74
5. Fine pitch interconnection technology /83
6. PKG technology trends of major assemblers /89
     TSMC, Intel, Samsung, Amkor, IBM, AOI, Shinko

B. Market trends
1. Market entry status of major assembly companies
  1.1 Wafer/panel based advanced package /112
  1.2 2.5D system type package /113
  1.3 3D IC package /115 
  1.4 Fan out PKG /116 
  1.5 FO PLP /118 
2. Market size forecast of 2.5D system type packages 
  2.1 By IC type /119 
  2.2 By PKG type /121
  2.3 By number of mounted HBM /125 
  2.4 By reticle size of IP /127
3. Market size forecast of Fan out packages
  3.1 By PKG type /131
  3.2 By RDL count /135
  3.3 By Assembly base shape /137

Chapter 4, Trends of main IC packaging materials

A. RDL Dielectric materials
1. Outline of Dielectric materials /145
2. Required characteristics of Dielectric materials /149
3. Applications for RDL and structure formation /151
4. Market entry status of Dielectric material suppliers /154
5. Product characteristic of Dielectric materials /163
6. Trends of market and manufacturers
  6.1 Market size in 2021 and the breakdowns
   1) Application x Photosensitive type /167
   2) Application x Polymer type /172
  6.2 Sales status of major dielectric material manufacturers
   1) By Photosensitive type of Total market /177
   2) By Polymer type of Total market /180
   3) By Application of Total market /183
   4) Market for Buffer coat /185
   5) Market for RDL /187
   6), 7) Market for Fan out/2.5D system type PKG /189
  6.3 Market size forecast
   1) By Photosensitive type of Total market /192 
   2) By Polymer type of Total market /194 
   3) By Application of Total market /196 
   4), 5) Market for Buffer coat /198 
   6) Market for RDL /202 
   7), 8) Market for Fan out/2.5D system type PKG /204 

B. Wafer/panel base encapsulant 
1. Outline of encapsulation technologies and materials /209 
2. Adoption trend of encapsulation technology for Chiplet PKG /217 
3. Other applications of sheet encapsulant /223 
4. Major suppliers' market entry status and material characteristics /225 
5. Trends of market and manufacturers 
  5.1 Market size and breakdowns in 2021 /231 
  5.2 Sales status of major encapsulant manufacturers 
   1) By type of Total market /233 
   2) By PKG type of Liquid market /235 
   3) By PKG type of Granule market /237 
  5.3 Market size forecast 
   1) By type of Total market /238 
   2) By PKG type of Total market /240 
   3) By PKG type of Liquid market /243 
   4) By PKG type of Granule market /245 
   5) By type of MUF market /247

Chapter 5, Case studies of assembly material suppliers

Ajinomoto Fine Techno /250
Asahi Kasei /254
Fujifilm Electronic Materials /259
HD MicroSystems /264
Nagase ChemteX /269
Namics /273
Resonac /276
Sanyu Rec /279
Sumitomo Bakelite /282
Toray Industries /288
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