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Power Module & Ceramic Substrate Report -2021-

~ A report that adds the latest data on ceramic substrates to the "Power Module Report" ~

Focal points of this report

< Features of this report >
◆ Added the latest data on ceramic substrates to "Power Module Report 2020” 
  * Power module data is updated only for market size forecast data.

< Focal points of survey >
▼ Market Trends and manufacturer trends of IGBT / SiC power modules 
- Classified by module capacity, by application, by insulating substrate material, by package type 
▼ The updated comparison tables of product lineup situation of major 23 power module companies 
- Classified by module capacity, by type of circuit, by PKG type, by PM / IPM
▼ Analysis of ceramic substrate market and corporate trends 
- Market by ceramic material (Si3N4, AlN, Zr-Al2O3, Al2O3), by application 
- Company case study of 10 major ceramic substrate manufacturers 
*To check the detail by PDF file

Table of Contents

Chapter 1, Executive Summary

1. Overview of power module market
1.1 Market overview  2
1.2 Trend of market size classified by module capacity  3
1.3 Trend of market size classified by application  4
1.4 Market size breakdown by module capacity and application  5
1.5 Major module manufacturers in various markets and the ranking  6
2. Overview of power module market by PKG technology
2.1 Trend of market size classified by PKG types 7
2.2 Trend of market size classified by insulating substrate material type  8
2.3 Trend of market size classified by module capacity  9
3. Overview of SiC power module market
3.1 Trends of total power module market and SiC introduction  12
3.2 Trend of market size classified by module capacity  13
3.3 Trend of market size classified by application  14
4. Technology trends of power modules
4.1 Power module capacity by application 15
4.2 Trends of power module technology change by application 16
4.3 Trends of power module devices and the packaging for xEV drive 17
5. A table of market entry trend by module manufacturer, classified by capacity  18
6. Trend analysis of major power module manufacturers  19

Chapter 2, Trends of power module products and the technologies

1. Outline of power device basics
1.1 Functions of power devices 22
1.2 Outlines of major power devices and their characteristics 23
1.3 Capacities and frequencies of power devices classified by types 25
1.4 Coverage of power electronics equipment and power devices 26
1.5 SiC power devices 27
2. Development trends of power semiconductor chips
2.1 RC-IGBT chip and the module 29
2.2 Trend of 300mm wafer introduction  31
2.3 Partner trends of the SiC wafer supply 32
3. Product outline of power modules and the trends
3.1 Capacity and internal circuit of IGBT modules  33
3.2 Compatible modules classified by power capacity  35
3.3 Power module for xEV drive  41
4. Package technology of power modules  
4.1 Basic functions and required characteristics of packages  46
4.2 Typical structures of power modules  47
4.3 Reliability and joining parts of power modules  48
4.4 Package technology to improve reliability and heat dissipation characteristics  49
5. Situation of market entry of power module companies
5.1 List of market entry situation of IGBT module companies  63
5.2 Situation classified by capacity and circuit, of companies who entered the IGBT market  64
5.3 List of situation of companies, who entered the SiC module market  85
5.4 Situation of productization of Full SiC modules aggregated for the 14 companies, classified by capacity and circuit  86
5.5 Situation classified by capacity and circuit, of companies who entered the SiC market  87

Chapter 3, Market trends of power modules

1. Power module whole market
1.1 Market size in 2019 and various breakdowns
1.1.1 Classification by module capacity and application (volume and value) 102
1.1.2 Classification by package type (volume)  105
1.1.3 Classification by insulating substrate material (volume)  107
1.2 Trends of major companies (2019)
1.2.1 Total volume and total value  109
1.2.2 Classification by module capacity  110
1.2.3 Classification by application  113
1.2.4 Classification by module capacity and application  117
1.2.5 Classification by package type and module capacity  118
1.2.6 Classification by package type and application  121
1.2.7 Classification by insulating substrate material and module capacity  124
1.2.8 Classification by insulating substrate material and application  129
1.3 Market size forecast
1.3.1 Classification by module capacity  134
1.3.2 Classification by application  136
1.3.3 Classification by module capacity and application  138
1.3.4 Classification by package type and module capacity  146
1.3.5 Classification by package type and application  149
1.3.6 Classification by insulating substrate material and module capacity  155
1.3.7 Classification by insulating substrate material and application  158
2. SiC power module market
2.1. Market size in 2019 and various breakdowns
2.1.1 Classification by module capacity and application (volume and value)  170
2.1.2 Classification by package type (volume) 173
2.1.3 Classification by insulating substrate material (volume) 175
2.2 Trends of major companies (2019)
2.2.1 Total volume and total value  177
2.2.2 Classification by module capacity  178
2.2.3 Classification by application  181
2.2.4 Classification by module capacity and application  183
2.2.5 Classification by package type  184
2.2.6 Classification by insulating substrate material  187
2.3 Market size forecast
2.3.1 Classification by module capacity  190
2.3.2 Classification by application  196
2.3.3 Classification by module capacity and application  202

Chapter 4, Trends of applications

1. xEV
1.1 Outline of xEV  211
1.2 Regulations and target values of spread of electric vehicles in each country  213
1.3 Electrification trends of automakers  216
1.4 Market size forecast of xEV  220
1.5 Sales volumes and market shares of xEV by OEM  222
2. New energy
2.1 New installation market size forecast of wind power generation  224
2.2 New installation market size forecast of solar PV  225
3. Major appliances  226

Chapter 5 Market trends of Ceramic substrate for power devices

1. Product outline 
1.1 Material characteristics  232 
1.2 Bonding technologies with metals  233 
1.3 Product lineup by thickness of materials  234 
1.4 Features and market fields of substrates by ceramic material  235
2. Market entry situation 
2.1 Metal ceramic substrate market by ceramic material  236
2.2 Metal ceramic substrate market by metal and ceramic bonding method  237 
2.3 Entry table by manufacturing process for metal ceramics boards  238
3. Market trends 
3.1 Market sizes in 2019, 2020 and various breakdowns  241 
3.2 Trends of major companies (2019 and 2020 years) 
3.2.1 Overall market by ceramic substrate material  244 
3.2.2 Si3N4 market by application  247 
3.2.3 AlN market by application  250 
3.2.4 Zr-Al2O3market by application  253 
3.2.5 Al2O3market by application  256 
3.2.6 Overall market by application 259
3.3 Market size forecast 
3.3.1 Overall market by ceramic substrate material  262 
3.3.2 Si3N4 market by application  265
3.3.3 AlN market by application  267 
3.3.4 Zr-Al2O3market by application  269 
3.3.5 Al2O3market by application  271 
3.3.6 Overall market by ceramic substrate material  273 
3.3.7 Market for Consumer by ceramic substrate material  276 
3.3.8 Market for Industrial by ceramic substrate material  278 
3.3.9 Market for Automotive by ceramic substrate material  280 
3.3.10 Market for New energy by ceramic substrate material  282 
3.3.11 Market for Railway by ceramic substrate material  284
4. Case studies of metal substrate
manufacturers Denka  287 
DOWA Metaltech / Tokuyama  292 
Ferrotec Material Technologies  299 
Hitachi Metals  304 
KCC  309 
Mitsubishi Materials  314 
NGK Electronics Devices  319 
Rogers  324 
Toshiba Materials  329
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