Japan Marketing Survey Co., Ltd.

　

1. Outline of power device basics

1.1 Functions of power devices 22

1.2 Outlines of major power devices and their characteristics 23

1.3 Capacities and frequencies of power devices classified by types 25

1.4 Coverage of power electronics equipment and power devices 26

1.5 SiC power devices 27

2. Development trends of power semiconductor chips

2.1 RC-IGBT chip and the module 29

2.2 Trend of 300mm wafer introduction　 31

2.3 Partner trends of the SiC wafer supply 32

3. Product outline of power modules and the trends

3.1 Capacity and internal circuit of IGBT modules　 33

3.2 Compatible modules classified by power capacity　 35

3.3 Power module for xEV drive　 41

4. Package technology of power modules　　

4.1 Basic functions and required characteristics of packages　 46

4.2 Typical structures of power modules　 47

4.3 Reliability and joining parts of power modules　 48

4.4 Package technology to improve reliability and heat dissipation characteristics　 49

5. Situation of market entry of power module companies

5.1 List of market entry situation of IGBT module companies　 63

5.2 Situation classified by capacity and circuit, of companies who entered the IGBT market　 64

5.3 List of situation of companies, who entered the SiC module market　 85

5.4 Situation of productization of Full SiC modules aggregated for the 14 companies, classified by capacity and circuit　 86

5.5 Situation classified by capacity and circuit, of companies who entered the SiC market　 87

1. Power module whole market

1.1 Market size in 2019 and various breakdowns

1.1.1 Classification by module capacity and application (volume and value) 102

1.1.2 Classification by package type (volume） 　105

1.1.3 Classification by insulating substrate material （volume） 　107

1.2 Trends of major companies (2019)

1.2.1 Total volume and total value 　109

1.2.2 Classification by module capacity 　110

1.2.3 Classification by application 　113

1.2.4 Classification by module capacity and application 　117

1.2.5 Classification by package type and module capacity 　118

1.2.6 Classification by package type and application 　121

1.2.7 Classification by insulating substrate material and module capacity 　124

1.2.8 Classification by insulating substrate material and application 　129

1.3 Market size forecast

1.3.1 Classification by module capacity 　134

1.3.2 Classification by application 　136

1.3.3 Classification by module capacity and application 　138

1.3.4 Classification by package type and module capacity 　146

1.3.5 Classification by package type and application 　149

1.3.6 Classification by insulating substrate material and module capacity 　155

1.3.7 Classification by insulating substrate material and application 　158

2. SiC power module market

2.1. Market size in 2019 and various breakdowns

2.1.1 Classification by module capacity and application (volume and value) 　170

2.1.2 Classification by package type (volume） 173

2.1.3 Classification by insulating substrate material （volume） 175

2.2 Trends of major companies (2019)

2.2.1 Total volume and total value 　177

2.2.2 Classification by module capacity 　178

2.2.3 Classification by application 　181

2.2.4 Classification by module capacity and application 　183

2.2.5 Classification by package type 　184

2.2.6 Classification by insulating substrate material 　187

2.3 Market size forecast

2.3.1 Classification by module capacity 　190

2.3.2 Classification by application 　196

2.3.3 Classification by module capacity and application 　202

1. xEV

1.1 Outline of xEV 　211

1.2 Regulations and target values of spread of electric vehicles in each country 　213

1.3 Electrification trends of automakers 　216

1.4 Market size forecast of xEV 　220

1.5 Sales volumes and market shares of xEV by OEM 　222

2. New energy

2.1 New installation market size forecast of wind power generation 　224

2.2 New installation market size forecast of solar PV 　225

3. Major appliances 　226

1. Product outline 

1.1 Material characteristics 　232 

1.2 Bonding technologies with metals 　233 

1.3 Product lineup by thickness of materials 　234 

1.4 Features and market fields of substrates by ceramic material 　235

2. Market entry situation 

2.1 Metal ceramic substrate market by ceramic material 　236

2.2 Metal ceramic substrate market by metal and ceramic bonding method 　237 

2.3 Entry table by manufacturing process for metal ceramics boards 　238

3. Market trends 

3.1 Market sizes in 2019, 2020 and various breakdowns 　241 

3.2 Trends of major companies (2019 and 2020 years) 

3.2.1 Overall market by ceramic substrate material 　244 

3.2.2 Si3N4 market by application 　247 

3.2.3 AlN market by application 　250 

3.2.4 Zr-Al2O3market by application 　253 

3.2.5 Al2O3market by application 　256 

3.2.6 Overall market by application 259

3.3 Market size forecast 

3.3.1 Overall market by ceramic substrate material 　262 

3.3.2 Si3N4 market by application 　265

3.3.3 AlN market by application 　267 

3.3.4 Zr-Al2O3market by application 　269 

3.3.5 Al2O3market by application 　271 

3.3.6 Overall market by ceramic substrate material 　273 

3.3.7 Market for Consumer by ceramic substrate material 　276 

3.3.8 Market for Industrial by ceramic substrate material 　278 

3.3.9 Market for Automotive by ceramic substrate material 　280 

3.3.10 Market for New energy by ceramic substrate material 　282 

3.3.11 Market for Railway by ceramic substrate material 　284

4. Case studies of metal substrate

manufacturers Denka 　287 

DOWA Metaltech / Tokuyama 　292 

Ferrotec Material Technologies 　299 

Hitachi Metals 　304 

KCC 　309 

Mitsubishi Materials 　314 

NGK Electronics Devices 　319 

Rogers 　324 

Toshiba Materials 　329