Power Module Report 2020
~ Technology and market trends of Power modules by device and package technology ~
Date | Published on 23 December, 2020 |
Price | Hard copy only:370,000JPY Hard Copy & Soft Copy(CD-ROM):400,000JPY |
Size | A4 x 226 pages |
 | "Power Module Report 2020" (851KB) *To check the detail by PDF file
|
Focal points of this report
* Market Trends and manufacturer trends of IGBT /SiC power modules
- Classified by module capacity
- Classified by application
- Classified by insulating substrate material
- Classified by package type
* The updated comparison tables of product lineup situation of major 23 power module companies
- Classified by module capacity, by type of circuit, by PKG type, by PM / IPM
* Package technology trends mainly oriented towards xEV drive
- Double-sided cooling structure, Direct / Indirect cooling
- Core technologies for high reliability and high heat dissipation of modules
Table of Contents
Chapter 1, Executive Summary
1. Overview of power module market
1.1 Market overview 2
1.2 Trend of market size classified by module capacity 3
1.3 Trend of market size classified by application 4
1.4 Market size breakdown by module capacity and application 5
1.5 Major module manufacturers in various markets and the ranking 6
2. Overview of power module market by PKG technology
2.1 Trend of market size classified by PKG types 7
2.2 Trend of market size classified by insulating substrate material type 8
2.3 Trend of market size classified by module capacity 9
3. Overview of SiC power module market
3.1 Trends of total power module market and SiC introduction 12
3.2 Trend of market size classified by module capacity 13
3.3 Trend of market size classified by application 14
4. Technology trends of power modules
4.1 Power module capacity by application 15
4.2 Trends of power module technology change by application 16
4.3 Trends of power module devices and the packaging for xEV drive 17
5. A table of market entry trend by module manufacturer, classified by capacity 18
6. Trend analysis of major power module manufacturers 19
Chapter 2, Trends of power module products and the technologies
1. Outline of power device basics
1.1 Functions of power devices 22
1.2 Outlines of major power devices and their characteristics 23
1.3 Capacities and frequencies of power devices classified by types 25
1.4 Coverage of power electronics equipment and power devices 26
1.5 SiC power devices 27
2. Development trends of power semiconductor chips
2.1 RC-IGBT chip and the module 29
2.2 Trend of 300mm wafer introduction 31
2.3 Partner trends of the SiC wafer supply 32
3. Product outline of power modules and the trends
3.1 Capacity and internal circuit of IGBT modules 33
3.2 Compatible modules classified by power capacity 35
3.3 Power module for xEV drive 41
4. Package technology of power modules
4.1 Basic functions and required characteristics of packages 46
4.2 Typical structures of power modules 47
4.3 Reliability and joining parts of power modules 48
4.4 Package technology to improve reliability and heat dissipation characteristics 49
5. Situation of market entry of power module companies
5.1 List of market entry situation of IGBT module companies 63
5.2 Situation classified by capacity and circuit, of companies who entered the IGBT market 64
5.3 List of situation of companies, who entered the SiC module market 85
5.4 Situation of productization of Full SiC modules aggregated for the 14 companies, classified by capacity and circuit 86
5.5 Situation classified by capacity and circuit, of companies who entered the SiC market 87
Chapter 3, Market trends of power modules
1. Power module whole market
1.1 Market size in 2019 and various breakdowns
1.1.1 Classification by module capacity and application (volume and value) 102
1.1.2 Classification by package type (volume） 105
1.1.3 Classification by insulating substrate material （volume） 107
1.2 Trends of major companies (2019)
1.2.1 Total volume and total value 109
1.2.2 Classification by module capacity 110
1.2.3 Classification by application 113
1.2.4 Classification by module capacity and application 117
1.2.5 Classification by package type and module capacity 118
1.2.6 Classification by package type and application 121
1.2.7 Classification by insulating substrate material and module capacity 124
1.2.8 Classification by insulating substrate material and application 129
1.3 Market size forecast
1.3.1 Classification by module capacity 134
1.3.2 Classification by application 136
1.3.3 Classification by module capacity and application 138
1.3.4 Classification by package type and module capacity 146
1.3.5 Classification by package type and application 149
1.3.6 Classification by insulating substrate material and module capacity 155
1.3.7 Classification by insulating substrate material and application 158
2. SiC power module market
2.1. Market size in 2019 and various breakdowns
2.1.1 Classification by module capacity and application (volume and value) 170
2.1.2 Classification by package type (volume） 173
2.1.3 Classification by insulating substrate material （volume） 175
2.2 Trends of major companies (2019)
2.2.1 Total volume and total value 177
2.2.2 Classification by module capacity 178
2.2.3 Classification by application 181
2.2.4 Classification by module capacity and application 183
2.2.5 Classification by package type 184
2.2.6 Classification by insulating substrate material 187
2.3 Market size forecast
2.3.1 Classification by module capacity 190
2.3.2 Classification by application 196
2.3.3 Classification by module capacity and application 202
Chapter 4, Trends of applications
1. xEV
1.1 Outline of xEV 211
1.2 Regulations and target values of spread of electric vehicles in each country 213
1.3 Electrification trends of automakers 216
1.4 Market size forecast of xEV 220
1.5 Sales volumes and market shares of xEV by OEM 222
2. New energy
2.1 New installation market size forecast of wind power generation 224
2.2 New installation market size forecast of solar PV 225
3. Major appliances 226
