IC Package Substrate Report 2019
Date | December 3, 2019 |
Price | Hard Copy + Soft Copy: JPY290,000- |
Size | A4 x 210 pages |
Keywords | IC Package, Substrate, FCBGA, FCCSP, |
 | *Pamphlet (499KB) |
Table of Contents
Chapter 1 Summary
- Market Size Forecast of IC Package Substrates (2015-2028)
- Market Size Forecast of Flip Chip Substrates (2015-2028)
- Actual Sales of Major IC Substrate Manufacturers in 2018
Chapter 2 FCBGA Substrates
- Overall Market of FCBGA Substrates in 2018
- Market Size of FCBGA Substrates by Applications/Layer Counts in 2018
- Market Size of FCBGA Substrates by Applications in 2018
- Market Size of FCBGA Substrates by Layer Counts in 2018
- Market Size of FCBGA Substrates in Application Fields
by Manufactures/Layer Counts in 2018
- Actual Sales of Major Manufactures by Applications/Layer Counts in 2018
- Market Size Forecast of FCBGA Substrates by Applications (2015-2028)
- Market Size Forecast of FCBGA Substrates by Layer Counts (2015-2028)
- Market Size Forecast of FCBGA Substrates in Application Fields
by Layer Counts (2015-2028)
Chapter 3 FCCSP Substrates
- Overall Market of FCCSP Substrates in 2018
- Market Share of Major Manufacturers by PKG Types in 2018
- Actual Sales of Major Manufacturers in 2018
- Market Size Forecast of FCCSP Substrates (2015-2028)
Chapter 4 Case Studies
*Japanese Manufacturers
1. Ibiden Co., Ltd.
2. SHINKO ELECTRIC INDUSTRIES CO., LTD.
3. KYOCERA Corporation
4. Toppan Printing Co., LTD
*Taiwanese Korean and Other Manufacturers
1. Unimicron Technology Corporation
2. Nan Ya Printed Circuit Board Corporation
3. Kinsus Interconnect Technology Corporation
4. Samsung Electro-Mechanics Company Limited
5. AT&S Austria Technologie & Systemtechnik AG
**Survey items**
1. Company Profile
2. IC Package Substrate Business
2-1. Manufacturing Sites
2-2. Major Products
2-3. Actual Sales of IC Package Substrates
