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Fan-Out-Panel-Level Package Report 2019

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the Purpose of Publication

To Provide Basic Information on the Global Fan-Out-Panel-Level Package Industry.
 
The size of the global market of Fan-Out-Panel-Level Packages is expected to expand rapidly.
- The size of the market will expand to several billion US dollars in several years
　in value.
- The size of the market will expand to several billion pieces in several years 
　in volume.
- The size of the market will expand to several million SQMs in several years 
　in volume.
a Remark: The size of the market in value excludes IC chips.
 
　Samsung Group has already been producing the FO-PLPs on a large scale. After massive investments in production facilities, Powertech Technology Inc. will start FO-PLP production in the first half of 2021.

　Considering the rapid growth of the market, JMS has prepared a research report on marketing and technological trends in the global FO-PLP industry.

　The report covers not only the FO-PLPs themselves but also materials for them. When you see tables on FO-PLP specifications in the report, you will find what kinds of materials are adopted in what parts of the FO-PLPs. THESE ARE EXTREMELY DETAILED SPECIFICATION TABLES COVERING MANY OTHER ITEMS SUCH AS ENCAPSULANT PRODUCT NAME AND RDL DIELECTRIC LAYER THICKNESS AND SO ON.

Table of Contents

[Preliminary Chapter] Preliminary Items

0. Preliminaries
1. an Overview of Fan-Out-Panel-Level Package Manufacturing
2. Examples of Manufacturing Flows of Fan-Out-Panel-Level Packages
 2-1. an Example of Manufacturing Flows of RDL-First-&-Face-Down-Type Fan-Out-Panel-Level Packages
 2-2. an Example of Manufacturing Flows of Chip-First-&-Face-Up-Type Fan-Out-Panel-Level Packages
 2-3. an Example of Manufacturing Flows of Chip-First-&-Face-Down-Type Fan-Out-Panel-Level Packages
3. Appendices to the Examples of Manufacturing Flows of Fan-Out-Panel-Level Packages
 3-1. Appendix: Seed Layer Application to Seed Layer Removal
 3-2. Appendix: Solder Mask Coating to Solder Mask Development
4. Fan-Out-Panel-Level-Package-Related Reference Information
 4-1. Illustrations of the Structure of an IC Wafer
  4-1-1. a Rough Pictorial Appearance of a Typical Wafer for Use in ICs After Die Fabrication
  4-1-2. a Rough Cross-Sectional Picture of an IC Die
 4-2. Illustrations of Structures of Bumped IC Wafers
  4-2-1. a Rough Pictorial Appearance of a Typical Solder-Bumped Wafer
  4-2-2. a Rough Cross-Sectional Picture of a Solder-Bumped IC Die
  4-2-3. a Rough Pictorial Appearance of a Typical Copper-Pillar-Bumped Wafer
  4-2-4. a Rough Cross-Sectional Picture of a Copper-Pillar-Bumped IC Die
 4-3. Fan-Out-Panel-Level-Package-Related Images
5. Embedded Trace Substrates
 5-1. an Example of Manufacturing Flows of Embedded Trace Substrates
 5-2. Remarks
 5-3. Embedded-Trace-Substrate-Related Images

[Chapter One] the Global Markets of FO-PLPs and Related Things

0. Preliminaries
 0-1. an Example of Fan-Out-Panel-Level Packages Manufactured by Samsung Electro-Mechanics Co., Ltd.
  0-1-1. an Example of Manufacturing Flows of Fan-Out-Panel-Level Packages Manufactured by Samsung Electro-Mechanics Co., Ltd.
  0-1-2. Appendices to “0-1-1.”
   0-1-2-1. a Modified Semi-Additive Process Possibly Utilized in Manufacturing the Three-Layer HDI in “0-1-1.”
   0-1-2-2. a Modified Semi-Additive Process Likely to be Utilized in Manufacturing the Three-Layer HDI in “0-1-1.”
  0-1-3. Samsung-Electro-Mechanics-Co.,-Ltd.-Manufactured-Fan-Out-Panel-Level-Package-Related Reference Information
 0-2. an Example of Fan-Out-Panel-Level Packages Manufactured with Mitsui Mining & Smelting's HRDP ®
  0-2-1. an Example of Manufacturing Flows of Fan-Out-Panel-Level Packages Manufactured with Mitsui Mining & Smelting's HRDP ®
  0-2-2. a Correlation Chart Between Mitsui Mining & Smelting Co., Ltd. and Geomatec Co., Ltd. in the HRDP Manufacturing Business
 0-3. an Example of Fan-Out-Panel-Level Packages Manufactured with Prepreg
  0-3-1. an Example of Manufacturing Flows of Fan-Out-Panel-Level Packages Manufactured with Prepreg
  0-3-2. a Related Image
 0-4. a Stepper-Related Small Piece of Reference Information
 
1. the Global Markets of Fan-Out-Panel-Level Packages and Related Products
 1-1. Categorization of Fan-Out-Panel-Level Packages and Related Things
  1-1-1. a Review on the Fan-Out-Panel-Level Packages Introduced in This Report
  1-1-2. The Expected Launching Years of FO-PLPs by Type of IC Chip
  1-1-3. Feasibility of FO-PLPs by Type of IC Chip
  1-1-4. Possible Entrant Industries
  1-1-5. Possible Entrant Manufacturers into the FO-PLP Industry
 1-2. the Global Markets of Fan-Out-Panel-Level Packages and Related Products
  1-2-0. IC Packages that are Expected to Adopt FO-PLPs
  1-2-1. the Global Markets of FO-PLP Application Products
   1-2-1-1. Smartphones
   1-2-1-2. Smart Watches
   1-2-1-3. Tablet PCs
   1-2-1-4. Note PCs
   1-2-1-5. Desk Top PCs
   1-2-1-6. Servers
   1-2-1-7. Video Game Consoles
  1-2-2. the Global Markets of FO-PLPs
   1-2-2-1. an Extended Overview
   1-2-2-2. the Entire Market
  1-2-3. the Global Markets of FO-PLPs by IC Type
   1-2-3-1. Application Processors
   1-2-3-2. CPUs
   1-2-3-3. GPUs
   1-2-3-4. FPGAs
   1-2-3-5. DRAMs
   1-2-3-6. NAND Flash Memories
   1-2-3-7. PMICs
  1-2-4. Manufacturers’ Share of the Global FO-PLP Markets
   1-2-4-1. 2018
   1-2-4-2. 2019
 1-3. Forecast on Specifications of Fan-Out-Panel-Level Packages, 2017 - 2028
  1-3-1. Application Processors
  1-3-2. CPUs
  1-3-3. GPUs
  1-3-4. FPGAs
  1-3-5. DRAMs
  1-3-6. NANDs
  1-3-7. PMICs

[Appendix Chapter] Corporate Presentations of Interviewees

1. Compeq Manufacturing Co., Ltd.
2. Elite Material Co., Ltd.
3. Kinsus Interconnect Technology Corporation
4. Nan Ya Printed Circuit Board Corporation
5. Unimicron Technology Corporation
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