Global IC Packaging Market Report -2026 Edition

~ Market Trends and Forecast by IC type, Package type and Region ~

This report provides a comprehensive analysis of the global semiconductor package market, covering a wide range of package types from advanced packages to traditional packages.

Analysis of the current IC market (excluding discrete devices, optoelectronic devices, and sensors) and market size forecasts through 2035.
ICs are classified into the categories shown in the table below. The total IC market is estimated at USD 711.5 billion in 2025 and is forecast to reach USD 1,466.8 billion by 2030 and USD 1,762 billion by 2035 (CAGR: 9.5%).
DRAM, GPUs, and Flash memory are expected to achieve the highest growth rates, driven by explosive AI demand, which has led to a sharp increase in their average selling prices.
This report examines and analyzes IC packaging trends for each of these IC categories.

Details of each segment are provided below.
Package Types:
Leadframe-based: SIP/DIP, SOP/TSOP, SON/QFN
Substrate-based: PCSP/FCCSP/SiP, PBGA/FCBGA/2.xD Packages, COF/TCP
Substrate-less: Fan-in WLP, Fan-out WLP, PLP, Bare Die
Regions: Japan, Taiwan, China, South Korea, Southeast Asia, North America, Europe, and Others

Publication Date

August 15, 2026

Contract & Price

Corporate contract: JPY500,000 *

*This contract allows for use within the purchasing company / organization.

Global contract: JPY660,000 **

**This contract allows for use within the purchasing company / organization and the subsidiaries

with a 51% stake or more.

We (JMS) hold the copyright on this report in any contract.

Size / Format

A4 x 186 pages

You can choose from the following three patterns:

*Hard copy (Book) + Soft copy (PDF) **Hard copy Only ***Soft copy Only

* If you have any questions or requests, please contact us here.

Chapter 1 Summary

1. ICs Overall: Market and Packaging Trends	1
1) Overview	2
2) Market Size Forecast by IC Type (Volume)	3
3) Market Size Forecast by IC Type (Value)	4
4) Semiconductor Manufacturer Ranking (2025)	7
5) Regional Forecast of IC Packaging Volumes	8
6) Market Size Forecast by IC Package Type (Volume)	10
7) OSAT Ranking (2025)	12
2. Memory ICs: Market and Packaging Trends	13
1) Overview	13
2) Market Size Forecast of Memory ICs by Type	14
3) Regional Forecast of Packaging Volumes for Memory ICs	16
4) Market Size Forecast of Memory ICs by Package Type (Volume)	18
3. Logic ICs: Market and Packaging Trends	20
1) Overview	20
2) Market Size Forecast of Logic ICs by Type	23
3) Regional Forecast of Packaging Volumes for Logic ICs	23
4) Market Size Forecast of Logic ICs by Package Type (Volume)	25
4. Analog ICs: Market and Packaging Trends	27
1) Overview	27
2) Market Size Forecast Analog IC by Types	28
3) Regional Forecast of Packaging Volumes for Analog ICs	30
4) Market Size Forecast of Analog ICs by Package Type (Volume)	32

Chapter 2 Trends in Memory ICs

1. DRAM: Market and Packaging Trends	34
1) Overview	35
2) Overview of DRAM Types	36
3) Market Size Forecast by DRAM Types	37
4) Regional Forecast of Packaging Volumes for DRAM	39
5) DRAM Package Types and Features	41
6) Technology Trends in DDR DRAM Packaging for PCs	42
7) Technology Trends in DDR DRAM Packaging for Servers	43
8) Technology Trends in LPDDR DRAM Package	44
9) Technology Trends in HBM Package	45
10) Market Size Forecast by Package Type for DRAM (Volume)	46
2. Flash Memory ICs: Market and Packaging Trends	48
2.1 Flash memory ICs	49
1) Market Size Forecast by Flash Memory Types	49
2) Regional Forecast of Packaging Volumes for Flash Memory ICs	51
3) Market Size Forecast by Package Type for Flash Memory ICs (Volume)	53
2.2 Nand Flash Memory IC: Market and Packaging Trends	55
1) Overview	55
2) Regional Forecast of Packaging Volumes for NAND Flash	56
3) Overview of NAND Flash Memory Package	58
4) Package Appearance	59
5) Market Size Forecast by Package Type for NAND Flash (Volume)	60
2.3 NOR Flash Memory IC: Market and Packaging Trends	62
1) Overview	62
2) Package Appearance	63
3) Regional Forecast of Packaging Volumes for NOR Flash	64
4) Market Size Forecast by Package Type for NOR Flash (Volume)	66
3. Other Memory ICs: Market and Packaging Trends	68
1) Overview	69
2) Market Size Forecast by Type for Other Memory ICs	70
3) Regional Forecast of Packaging Volumes for Other Memory ICs	71
4) Market Size Forecast by Package Type for Other Memory ICs (Volume)	73
5) Package Appearance	75

Chapter 3 Trends in Logic ICs

1. MPU: Market and Packaging Trends	76
1) Overview	77
2) Market Trends of MPU	78
3) Regional Forecast of Packaging Volumes for MPU	81
4) Package Technology Trends for MPU	83
5) Structure of MPU Package for PC	84
6) Structure of MPU Package for Server	85
7) Market Size Forecast by Package Type for MPU (Volume)	86
2. GPU: Market and Packaging Trends	88
1) Overview	89
2) Market Trends of GPU	90
3) Regional Forecast of Packaging Volumes for GPU	93
4) Package Technology Trends for GPU	95
5) Structure of MPU Package for AI Server	96
6) Market Size Forecast by Package Type for GPU (Volume)	97
3. ASIC/FPGA: Market and Packaging Trends	99
1) Overview	100
2) Market Size Forecast of ASIC/FPGA by Type	101
3) Regional Forecast of Packaging Volumes for ASIC/FPGA	103
4) Market Size Forecast by Package Type for ASIC/FPGA (Volume)	105
5) Package Appearance	107
4. Mobile Aps: Market and Packaging Trends	108
1) Overview	109
2) Market Size Forecast of Mobile APs	110
3) Regional Forecast of Packaging Volumes for Mobile APs	111
4) Overview of Package Technology for Mobile APs	113
5) Overview of Package Structure for Mobile APs	114
6) Market Size Forecast by Package Type for Mobile APs (Volume)	115
5. MCU	117
1) Overview	118
2) Market Size Forecast of MCU by Types	119
3) Regional Forecast of Packaging Volumes for MCU	125
4) Market Size Forecast by Package Type for MCU (Volume)	127
5) Package Appearance	128
6. Trends in Special Purpose (S.P.) Logic Ics	130
6.1 S. P. Logic ICs: Market and Packaging Trends	131
1) Overview	131
2) Market Size Forecast of S. P. Logic ICs	132
3) Regional Forecast of Packaging Volumes for S. P. Logic ICs	134
4) Market Size Forecast by Package Type for S. P. Logic ICs (Volume)	136
6.2 Consumer S. P. Logic IC: Market and Packaging Trends	138
1) Overview	138
2) Regional Forecast of Packaging Volumes for Consumer S. P. Logic IC	139
3) Market Size Forecast by Package Type for Consumer S. P. Logic IC (Volume)	141
6.3 Computer S. P. Logic IC: Market and Packaging Trends	143
1) Overview	143
2) Regional Forecast of Packaging Volumes for Computer S. P. Logic IC	144
3) Market Size Forecast by Package Type for Computer S. P. Logic IC (Volume)	146
6.4 Network IC (Wired): Market and Packaging Trends	148
1) Overview	148
2) Regional Forecast of Packaging Volumes for Network IC	149
3) Market Size Forecast by Package Type for Network IC (Volume)	151
4) Package Appearance	153
6.5 Wireless S. P. Logic IC: Market and Packaging Trends	154
1) Overview	154
2) Market Size Forecast of Wireless S. P. Logic IC by Applications	155
3) Regional Forecast of Packaging Volumes for Wireless S. P. Logic IC	157
4) Market Size Forecast by Package Type for Wireless S. P. Logic IC (Volume)	159
6.6 Auto S. P. Logic IC: Market and Packaging Trends	161
1) Overview	161
2) Regional Forecast of Packaging Volumes for Auto S. P. Logic IC	162
3) Market Size Forecast by Package Type for Auto S. P. Logic IC (Volume)	164
6.7 Other S. P. Logic IC: Market and Packaging Trends	166
1) Overview	166
2) Regional Forecast of Packaging Volumes for Other S. P. Logic IC	167
3) Market Size Forecast by Package Type for Other S. P. Logic IC (Volume)	169
7. Display Driver IC: Market and Packaging Trends	171
1) Overview	171
2) Market Size Forecast of Display Driver IC by Applications	173
3) Regional Forecast of Packaging Volumes for Display Driver IC	174
4) Market Size Forecast by Package Type for Display Driver IC (Volume)	177
5) Package Structure of COF/TCP	179
8. Other Logic ICs: Market and Packaging Trends	180

Japan Marketing Survey Co., Ltd.