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IC Package Report

IC Package Report
Focal points of the Report:
- This report analyzes the market size trends and forecasts from 2022 to 2034 by package type and region for various types of ICs.
- ICs are classified into 17 types, with each IC analyzed by 14 package types and across 8 regions. 

Overview of IC Package Market

1. IC Market Trends
The market size of the product in 2024 is projected to be 351,230 MPCS on a volume basis and 563,070 MUSD on a value basis. 
By 2034, it is expected to reach 443,276 MPCS (CAGR: 2.4%) in volume and 948,105 MUSD in value. (CAGR: 5.3%)
The higher growth rate on a value basis is primarily due to the exceptionally high value-based CAGR of GPU and DRAM, which are 14.3% and 6.1% respectively. Both products are targeted at the mobile end market.
 
2. IC Packaging by Region
Currently, the region with the highest share is China, accounting for approximately 33%, followed by Taiwan at 18% and Southeast Asia at 17%, meaning these two regions together make up 68% of the total.
The reason China has a high-volume share is due to the large volume of assembly for low-cost products, including analog ICs. Going forward, Southeast Asia is expected to see the highest growth rate. 
This is because Taiwan and Korea are shifting toward higher value-added products, which will lead to a decline in volume in those regions, and Southeast Asia will absorb that volume increase.
 
3. IC Package Trends
Currently, Lead Frame-type packages have the highest share at 72%, followed by CSP-type at 14%, Substrate-less type at 12%, and BGA-type at 0.6%.
Going forward, Lead Frame types are expected to show a slight increase and will remain the mainstream in IC packaging. Among the various types, Substrate-less packages are projected to have the highest growth rate, particularly in the Fan-in and Fan-out categories.
While the overall growth of CSP is not expected to be significant, there will be a gradual shift from PCSP to FCCSP. In the BGA category, strong growth is expected in FCBGA and 2.xD types.

Table of Contents

Chapter 1 Summary

1. ICs Overall: Market and Packaging Trends
　1) Overview    /2
　2) Market Size Forecast by IC Type (Volume)      /3
　3) Market Size Forecast by IC Type (Value)    /4
　4) Regional Forecast of IC Packaging Volumes      /7
　5) Market Size Forecast by IC Package Type (Volume)    /9
2. Memory ICs: Market and Packaging Trends
　1) Overview     /11
　2) Market Size Forecast of Memory ICs by Type      /12
　3) Regional Forecast of Packaging Volumes for Memory ICs     /14
　4) Market Size Forecast of Memory ICs by Package Type (Volume)     /16
3. Logic ICs: Market and Packaging Trends
　1) Overview     /18
　2) Market Size Forecast of Logic ICs by Type      /19
　3) Regional Forecast of Packaging Volumes for Logic ICs     /21
　4) Market Size Forecast of Logic ICs by Package Type (Volume)     /23
4. Analog ICs: Market and Packaging Trends
　1) Overview     /25
　2) Market Size Forecast Analog IC by Types      /26
　3) Regional Forecast of Packaging Volumes for Analog ICs      /28
　4) Market Size Forecast of Analog ICs by Package Type (Volume)     /30

Chapter 2 Trends in Memory ICs

1. DRAM: Market and Packaging Trends
　1) Overview        /33
　2) Overview of DRAM Types      /34
　3) Market Size Forecast by DRAM Types      /35
　4) Regional Forecast of Packaging Volumes for DRAM       /37
　5) DRAM Package Types and Features      /39
　6) Technology Trends in DDR DRAM Packaging for PCs      /40
　7) Technology Trends in DDR DRAM Packaging for Servers      /41
　8) Technology Trends in LPDRAM Package      /42
　9) Technology Trends in HBM Package      /43
　10) Market Size Forecast by Package Type for DRAM (Volume)      /44
2. Flash Memory ICs: Market and Packaging Trends 
　2.1 Flash memory ICs 
　　1) Market Size Forecast by Flash Memory Types      /47
　　2) Regional Forecast of Packaging Volumes for Flash Memory ICs     /49
　　3) Market Size Forecast by Package Type for Flash Memory ICs (Volume)     /51
　2.2 Nand Flash Memory IC: Market and Packaging Trends
　　1) Overview      /53
　　2) Regional Forecast of Packaging Volumes for NAND Flash      /54
　　3) Overview of NAND Flash Memory Package      /56
　　4) Package Appearance      /57
　　5) Market Size Forecast by Package Type for NAND Flash (Volume)      /58
　2.3 NOR Flash Memory IC: Market and Packaging Trends 
　　1) Overview      /60
　　2) Package Appearance      /61
　　3) Regional Forecast of Packaging Volumes for NOR Flash      /62
　　4) Market Size Forecast by Package Type for NOR Flash (Volume)     /64
3. Other Memory ICs: Market and Packaging Trends 
　1) Overview     /67
　2) Market Size Forecast by Type for Other Memory ICs      /68
　3) Regional Forecast of Packaging Volumes for Other Memory ICs      /69
　4) Market Size Forecast by Package Type for Other Memory ICs (Volume)     /71
　5) Package Appearance     /73

Chapter 3 Trends in Logic ICs

1. MPU: Market and Packaging Trends 
　1) Overview     /75
　2) Market Size Forecast of MPU by Applications      /76
　3) Regional Forecast of Packaging Volumes for MPU      /78
　4) Package Technology Trends for MPU      /80
　5) Structure of MPU Package for PC      /81
　6) Structure of MPU Package for Server      /82
　7) Market Size Forecast by Package Type for MPU (Volume)      /83
2. GPU: Market and Packaging Trends
　1) Overview      /86
　2) Market Size Forecast of GPU by Applications      /87
　3) Regional Forecast of Packaging Volumes for GPU      /89
　4) Package Technology Trends for GPU      /91
　5) Structure of MPU Package for AI Server      /92
　6) Market Size Forecast by Package Type for GPU (Volume)      /93
3. ASIC/FPGA: Market and Packaging Trends 
　1) Overview     /96
　2) Market Size Forecast of ASIC/FPGA by Type      /97
　3) Regional Forecast of Packaging Volumes for ASIC/FPGA      /99
　4) Market Size Forecast by Package Type for ASIC/FPGA (Volume)      /101
　5) Package Appearance      /103
4. Mobile Aps: Market and Packaging Trends
　1) Overview      /105
　2) Market Size Forecast of Mobile APs       /106
　3) Regional Forecast of Packaging Volumes for Mobile APs       /107
　4) Overview of Package Technology for Mobile APs      /109
　5) Overview of Package Structure for Mobile APs       /110
　6) Market Size Forecast by Package Type for Mobile APs (Volume)      /111
5. MCU 
　1) Overview      /114
　2) Market Size Forecast of MCU by Types       /115
　3) Regional Forecast of Packaging Volumes for MCU       /121
　4) Market Size Forecast by Package Type for MCU (Volume)      /123
　5) Package Appearance      /124
6. Trends in Special Purpose (S.P.) Logic ICs
　6.1 S. P. Logic ICs: Market and Packaging Trends 
　　1) Overview      /127
　　2) Market Size Forecast of S. P. Logic ICs      /128
　　3) Regional Forecast of Packaging Volumes for S. P. Logic ICs       /130
　　4) Market Size Forecast by Package Type for S. P. Logic ICs (Volume)      /132
　6.2 Consumer S. P. Logic IC: Market and Packaging Trends
　　1) Overview      /134
　　2) Regional Forecast of Packaging Volumes for Consumer S. P. Logic IC       /135
　　3) Market Size Forecast by Package Type for Consumer S. P. Logic IC (Volume)     /137
　6.3 Computer S. P. Logic IC: Market and Packaging Trends
　　1) Overview      /139
　　2) Regional Forecast of Packaging Volumes for Computer S. P. Logic IC       /140
　　3) Market Size Forecast by Package Type for Computer S. P. Logic IC (Volume)      /142
　6.4 Network IC (Wired): Market and Packaging Trends 
　　1) Overview      /144
　　2) Regional Forecast of Packaging Volumes for Network IC       /145
　　3) Market Size Forecast by Package Type for Network IC (Volume)      /147
　　4) Package Appearance      /149
　6.5 Wireless S. P. Logic IC: Market and Packaging Trends 
　　1) Overview     /150
　　2) Market Size Forecast of Wireless S. P. Logic IC by Applications      /151
　　3) Regional Forecast of Packaging Volumes for Wireless S. P. Logic IC       /153
　　4) Market Size Forecast by Package Type for Wireless S. P. Logic IC (Volume)     /155
　6.6 Auto S. P. Logic IC: Market and Packaging Trends
　　1) Overview      /157
　　2) Regional Forecast of Packaging Volumes for Auto S. P. Logic IC       /158
　　3) Market Size Forecast by Package Type for Auto S. P. Logic IC (Volume)      /160
　6.7 Other S. P. Logic IC: Market and Packaging Trends
　　1) Overview     /162
　　2) Regional Forecast of Packaging Volumes for Other S. P. Logic IC      /163
　　3) Market Size Forecast by Package Type for Other S. P. Logic IC (Volume)     /165
7. Display Driver IC: Market and Packaging Trends 
　1) Overview     /167
　2) Market Size Forecast of Display Driver IC by Applications     /169
　3) Regional Forecast of Packaging Volumes for Display Driver IC      /171
　4) Market Size Forecast by Package Type for Display Driver IC (Volume)     /173
　5) Package Structure of COF/TCP     /175
8. Other Logic ICs: Market and Packaging Trends     /176
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