2.5D/3D Packaging and Encapsulant Trends - 2025 Edition
~ Trends in 2.5D Packaging, HBM, and Wafer/Panel-Based Encapsulation Materials for AI Semiconductors ~
[ Scope of Research ]
* Advanced Packaging: 2.5D-type Packages, HBM, FO-WLP/PLP, etc.
* Encapsulants: LCM, Granular and MUF Materials for Wafer-/Panel-Based Assembly, and Flip-Chip CUF
[ Key Focus Areas of the Report ]
* Trends in xPUs (CPU, GPU) and AI ASICs with a Focus on AI Accelerators
* Expansion of 2.5D-type Packaging and HBM’s Move to Higher Stacking and Hybrid Bonding
* Shift Toward Panel-Level Assembly and Trends in Encapsulant Adoption
* Market Trends in 2.5D-type Packaging, HBM, and FO-WLP/PLP
* Trends in Wafer-/Panel-Based LCM, Granular, and MUF Materials, and in Narrow-Gap CUF Materials
Publication Date | December 10, 2025 |
Contract & Price | Corporate contract: JPY600,000 * *This contract allows for use within the purchasing company / organization. Global contract: JPY800,000 ** **This contract allows for use within the purchasing company / organization and the subsidiaries with a 51% stake or more. We (JMS) hold the copyright on this report in any contract. |
Size / Format | A4 x 203 pages You can choose from the following three patterns: *Hard copy (Book) + Soft copy (PDF) **Hard copy Only ***Soft copy Only |
Table of Contents
Chapter 1, Executive Summary
1. Market Trends Summary /p2
2. 2.5D-type Package Market Trends /p7
3. 3D Package / HBM Market Trends /p13
4. Fan-out Package Market Trends /p14
5. Company Entry trends into 2.5D-type Packaging /p17
6. Technology Roadmap /p19
7. Market Trends for Wafer/Panel-Level Encapsulants /p24
8. Flip-Chip CUF Material Market Trends /p27
Chapter 2, Trends in Major ICs for AI Applications
1. Silicon Process Miniaturization Roadmap /p30
2. IC for Server / HPC /p31
3. Product Trends of Major xPU Companies /p34
4. Other ICs for HPC/high-end Server /p50
Chapter 3, Trends in Advanced IC Packaging
A. Technology trends
1. Outline of Chiplet / IC integration technology /p55
2. Overview of Advanced Packaging Technologies /p59
3. 2.5D-type Packaging /p61
4. 3D Packaging /p71
5. Fine-Pitch Interconnect Technology /p76
B. Market Trends
1. Market entry status of major assembly companies /p83
2. 2.5D-type Package Market Outlook (2023 – 2035)
2.1 Overall Market /p89
2.2 Market Trends by Package Type /p97
2.3 Market Trends by Applications and ICs /p111
2.4 Market Trends by Assembly Base Type /p128
3. 3D Package Market Outlook (2023 – 2035)
3.1 HBM Unit-Based Market /p133
3.2 HBM Wafer-Based Market /p137
4. Fan-out PKG Market Outlook (2023 – 2035)
4.1 Overall Market /p139
4.2 Markets by Package Type /p143
4.3 Markets by Assembly Base Type (Wafer / Panel) /p149
Chapter 4, Trends in Encapsulants for Advanced Packaging
1. Outline of encapsulation technologies and materials /p154
2. Adoption trend of encapsulation technology for Chiplet PKG /p162
3. Other applications of sheet encapsulant /p168
4. Major suppliers' market entry status and material characteristics /p170
5. Trends of market and manufacturers
5.1 Sales status of major encapsulant manufacturers /p178
LCM Materials
Granular Materials
MUF Materials
CUF Materials
5.2 Market size forecast /p191
LCM Materials
Granular Materials
MUF Materials
CUF Materials
