Trends in 2.xD Packaging and RDL Materials 2025
~ Trends in Chiplet Packages and Interposers for AI-Oriented xPUs ~
[ Scope of Research ]
* Advanced Packaging: 2.xD Packages, 3.5D Packages, FO-PKG, etc.
* RDL Materials: Photosensitive Dielectric Materials
[ Key Focus Areas of the Report ]
* Market expansion trends of xPUs and AI ASICs, primarily for AI accelerators
* Trend toward larger chiplet packages and the resulting diversification of interposers (2.xD evolution)
* Shift toward resin-based interposers and panel-level packaging (PLP)
* Market expansion of RDL dielectric materials and the impact of PLP adoption
Scheduled Publication Date | April 30, 2025 |
Contract & Price | Corporate contract: JPY550,000- * *This contract allows for use within the purchasing company / organization. Global contract: JPY770,000- ** **This contract allows for use within the purchasing company / organization and the subsidiaries with a 51% stake or more. We (JMS) hold the copyright on this report in any contract. |
Size / Format | A4 x 230 pages You can choose from the following three patterns: *Hard copy (Book) + Soft copy (PDF) **Hard copy Only ***Soft copy Only |
Table of Contents
Chapter 1, Executive Summary
1. Market Trends Summary /p2
2. 2.xD Package Market Trends /p6
3. Fan-out Package Market Trends /p12
4. Adoption Trends of 2.xD Packaging in Major ICs /p15
5. Technology roadmap /p17
6. Market trends of Dielectric materials /p22
2. 2.xD Package Market Trends /p6
3. Fan-out Package Market Trends /p12
4. Adoption Trends of 2.xD Packaging in Major ICs /p15
5. Technology roadmap /p17
6. Market trends of Dielectric materials /p22
Chapter 2, Semiconductor Node Scaling and xPU Trends
1. Silicon process miniaturization roadmap /p26
2. IC for server / HPC /p27
3. Product trends of major xPUcompanies /p30
4. Other ICs for HPC/high-end server /p45
2. IC for server / HPC /p27
3. Product trends of major xPUcompanies /p30
4. Other ICs for HPC/high-end server /p45
Chapter 3, Chiplet Integration and 2.xD Packaging Trends
A. Technology trends
1. Outline of Chiplet/ IC integration technology /p50
2. Overview of Advanced Packaging Technologies /p54
3. 2.xD Packaging /p56
4. 3D Packaging /p66
5. Fine-Pitch Interconnect Technology /p70
1. Outline of Chiplet/ IC integration technology /p50
2. Overview of Advanced Packaging Technologies /p54
3. 2.xD Packaging /p56
4. 3D Packaging /p66
5. Fine-Pitch Interconnect Technology /p70
B. Market Trends
1. Market entry status of major assembly companies /p77
2. 2.xD Package Market Outlook (2023 –2035) /p83
3. Fan-out PKG Market Outlook (2023 –2035) /p123
1. Market entry status of major assembly companies /p77
2. 2.xD Package Market Outlook (2023 –2035) /p83
3. Fan-out PKG Market Outlook (2023 –2035) /p123
Chapter 4, Trends of RDL Dielectric materials
1. Outline of Dielectric materials /p138
2. Required characteristics of Dielectric materials /p142
3. Application Use Cases /p144
4. Market entry status of Dielectric material suppliers /p148
5. Product characteristic of Dielectric materials /p157
6. Trends of market and manufacturers
6.1 Market size in 2024 and the breakdowns /p163
6.2 Sales status of major dielectric material manufacturers /p173
6.3 Market size forecast (2023~2035) /p188
2. Required characteristics of Dielectric materials /p142
3. Application Use Cases /p144
4. Market entry status of Dielectric material suppliers /p148
5. Product characteristic of Dielectric materials /p157
6. Trends of market and manufacturers
6.1 Market size in 2024 and the breakdowns /p163
6.2 Sales status of major dielectric material manufacturers /p173
6.3 Market size forecast (2023~2035) /p188
Chapter 5, Case Studies on Major Materials Suppliers
Asahi Kasei
Fujifilm Electronic Materials
HD MicroSystems
Sumitomo Bakelite
Sumitomo Bakelite
Toray Industries /p205 -230
