Glass Substrate Report
~ Glass Substrates for Advanced Semiconductor Packages~
Focal points of the Report:
- This Report Focuses on Glass Substrates for Advanced Semiconductor Packages
- Market & Technology Study of Glass Substrates by Product Stage
* Product Stage : Plane Glass/TGV Glass Substrate/Metalized TGV Glass Substrate/Glass Core FCBGA Substrates/Glass Interposers
* Market Study : Market Scale Forecast (2024-2035, Volume/Value)
* Technology Study :
Comparative Analysis of Various Construction Methods (TGV/Metalizing)
Technology Roadmap of Glass Core FCBGA & Glass interposer
- Case Study of Companies Related to Glass Substrates
Published Date | March 31, 2025 |
Contract & Price | Corporate contract: JPY700,000 * *This contract allows for use within the purchasing company / organization. Global contract: JPY930,000 ** **This contract allows for use within the purchasing company / organization and the subsidiaries with a 51% stake or more. We (JMS) hold the copyright on this report in any contract. |
Size / Format | A4 x 207 pages You can choose from the following three patterns: *Hard copy (Book) + Soft copy (PDF) **Hard copy Only ***Soft copy Only |
Table of Contents
Chapter 1 Trend in Advanced Semiconductor Packages for AI/Server
Demand trends of Glass Substrates by ICs p2
Market Scale forecast of Advanced Semiconductor Packages for AI/Server : Whole/MPU/GPU/ASIC/NPU p3
Projected Demand Analysis of Glass Substrates : Whole/MPU/GPU/ASIC/NPU p17
Market Scale Forecast of Glass Substrates p22
Market Scale Forecast of Glass Substrates by Manufacturing Process p26
ASP trend of glass substrates by processes p27
Semiconductor Manufacturers' Initiatives for Glass Substrates p28
Development Partnerships Regarding Glass Substrates p29
Chapter 2 Market & Technology Trends for Glass Substrates
A: Overview
Manufacturing Process of Glass core Substrates/Glass Interposer p31
Process flow of Glass core Substrates/Glass Interposer p32
Glass Substrates’ Manufacturers by Manufacturing Process p33
Entry status into the Glass Substrate Market Glass Substrates p34
Challenges of Each Elemental Technology in Glass Substrates p38
Regarding Micro Crack of Glass Substrates p39
B: TGV (Through Glass Via) Substrates
Overview of Each TGV Method p41
Characteristics of Each TGV Shapes p43
Comparison of the Advantages of TGV Shape by Process p44
Technical Details of TGV Substrates Manufacturers p45
Specs of TGV Substrates Manufacturers p46
Procurement Status of Plane Glass by TGV Substrate Manufacturers p47
Technology Trends in TGV Substrates p48
Market Scale Forecast of TGV Substrates : Whole/MPU/GPU/ASIC/NPU p49
Market Scale Forecast of TGV Substrates for Glass core FCBGA by ICs p55
Market Scale Forecast of TGV Substrates for Glass Interposers by ICs p57
AGC p59
NICHIWA KOGYO Co., Ltd. p62
MUSASHINO FINE GLASS CO.,LTD p64
MICRO TECHNOLOGY Co., Ltd. p66
NSC Co., Ltd. p68
LPKF Laser & Electronics SE p71
Hubei Tongge Microcircuit Technology Co., Ltd. p74
JNTC Co.,Ltd. p77
JOONGWOO M-TECH CO.,LTD. p79
Samtec INC. p81
C: Metalized TGV Substrates
Overview and Characteristics of Various Seed Layer Formation Technologies p85
Adoption Status of Seed Layer Formation Technology by Metallized TGV Substrate Manufacturers p86
Overview and Characteristics of Via Filling Technologies p87
Technology Trends in Metalized TGV Substrates p88
Market Scale Forecast of Metalized TGV Substrates : Seed Layer (Whole/MPU/GPU/ASIC/NPU) p89
Market Scale Forecast of Metalized TGV Substrates (Seed Layer) for Glass core FCBGA by ICs p95
Market Scale Forecast of Metalized TGV Substrates (Seed Layer) for Glass Interposer by Ics p97
Market Scale Forecast of Metalized TGV Substrates : Filling (Whole/MPU/GPU/ASIC/NPU) p99
Market Scale Forecast of Metalized TGV Substrates (Filling) for Glass core FCBGAs by ICs p105
Market Scale Forecast of Metalized TGV Substrates (Filling) for Glass Interposers by ICs p107
DNP : DAINIPPON PRINTING Co., Ltd. p109
TOPPAN Co., ltd. p111
EBINAX Co., ltd. p113
KOTO ELECTRIC Co., Ltd. p115
NSC Co., ltd. p118
ABSOLICS Inc. p120
Intel p122
D: Glass core FCBGA Substrates/Glass Interposers
D-1 Glass core FCBGA
The Significance of Glass Substrates in Semiconductor Packaging p126
Trends of Glass Substrates for Advanced Semiconductor Packaging p127
Glass core Vs Organic core p128
Market Scale Forecast of Glass core FCBGA Substrates p129
ASP Trends of Glass core FCBGA Substrates p131
Product Trends in Glass core FCBGA Substrates p132
Technology Trends in Glass core FCBGA Substrates（Specs of Substrates） p133
Technology Trends in Glass core FCBGA Substrates（Manufacturing Technology） p134
D-2 Glass interposer
Overview and Characteristics of Interposers for Advanced Semiconductor Packaging p138
Comparison of Characteristics of Each Interposers p139
Overview of Si Interposers p140
Overview of Organic Interposers p141
Market Scale Forecast of Glass Interposers p142
ASP Trends of Glass Interposers p144
Product Trends in Glass Interposers p145
Technology Trends in Glass Interposers（Specs of Interposers） p146
Technology Trends in Glass Interposers（Production Technology） p147
E: Related Materials
E-1: Plane Glass Board p150
E-2: Plating solutions p163
E-3: Insulation layer materials p177
F: Related Machines
F-1: Exposure machine p187
F-2: Laset drill machine p197
F-3: CMP machine p206
