Glass Substrate Report
~ Glass Substrates for Advanced Semiconductor Packages~
Focal points of the Report:
- This Report Focuses on Glass Substrates for Advanced Semiconductor Packages
- Market & Technology Study of Glass Substrates by Product Stage
* Product Stage : Plane Glass/TGV Glass Substrate/Metalized TGV Glass Substrate/Glass Core FCBGA Substrates/Glass Interposers
* Market Study : Market Scale Forecast (2024-2035, Volume/Value)
* Technology Study :
Comparative Analysis of Various Construction Methods (TGV/Metalizing)
Technology Roadmap of Glass Core FCBGA & Glass interposer
- Case Study of Companies Related to Glass Substrates
Published Date | March 31, 2025 |
Contract & Price | Corporate contract: JPY700,000- * *This contract allows for use within the purchasing company / organization. Global contract: JPY930,000- ** **This contract allows for use within the purchasing company / organization and the subsidiaries with a 51% stake or more. We (JMS) hold the copyright on this report in any contract. |
Size / Format | A4 x 180 pages You can choose from the following three patterns: *Hard copy (Book) + Soft copy (PDF) **Hard copy Only ***Soft copy Only |
Table of Contents
Chapter 1 Trend of Advanced Semiconductor Packages for AI/Server
Segments and Descriptions of Advanced Semiconductor Packages for AI/Server 2
Market Scale forecast of Advanced Semiconductor Packages for AI/Server 3
MPU 6
GPU 9
ASIC 12
NPU 15
Projected Demand Analysis of Glass Substrates 17
Market Scale Forecast of Glass Substrates 22
Market Scale Forecast of Glass Substrates by Manufacturing Process 26
Semiconductor Manufacturers' Initiatives for Glass Substrates 27
Development Partnerships Regarding Glass Substrates 28
Chapter 2 Market & Technology Trends for Glass Substrates
A: Overview
Manufacturing Process of Glass core Substrates/Glass Interposer 30
Process flow of Glass core Substrates/Glass Interposer 31
Glass Substrates’ Manufacturers by Manufacturing Process 32
Entry status into the Glass Substrate Market Glass Substrates 33
Challenges of Each Elemental Technology in Glass Substrates 37
Regarding Micro Crack of Glass Substrates 38
B: TGV (Through Glass Via) Substrates
Overview of Each TGV Method 40
Characteristics of Each TGV Shapes 42
Comparison of the Advantages of TGV Shape by Process 43
Technical Details of TGV Substrates Manufacturers 44
Specs of TGV Substrates Manufacturers 45
Procurement Status of Plane Glass by TGV Substrate Manufacturers 46
Technology Trends in TGV Substrates 47
Market Scale Forecast of TGV Substrates 49
AGC 50
NICHIWA KOGYO Co., Ltd. 53
MUSASHINO FINE GLASS CO.,LTD 55
MICRO TECHNOLOGY Co., Ltd. 57
NSC Co., Ltd. 59
LPKF Laser & Electronics SE 62
Hubei Tongge Microcircuit Technology Co., Ltd. 65
JNTC Co., Ltd. 68
JOONGWOO M-TECH CO.,LTD. 70
Samtec INC. 72
C: Metalized TGV Substrates
Overview and Characteristics of Various Seed Layer Formation Technologies 76
Adoption Status of Seed Layer Formation Technology by Metallized TGV 77
Substrate Manufacturers Overview and Characteristics of Via Filling Technologies 78
Technology Trends in Metalized TGV Substrates 79
Market Scale Forecast of Metalized TGV Substrates : TGV + Seed Layer 80
Market Scale Forecast of Metalized TGV Substrates : TGV + Seed Layer + Filling 82
DNP : DAINIPPON PRINTING Co., Ltd. 84
TOPPAN Co., ltd. 86
EBINAX Co., ltd. 88
KOTO ERECTRIC Co., Ltd. 90
NSC Co., ltd. 93
ABSOLICS Inc. 95
Intel 97
D: Glass core FCBGA Substrates/Glass Interposers
D-1 Glass core FCBGA 100
The Significance of Glass Substrates in Semiconductor Packaging 101
Trends in Glass Substrates for Advanced Semiconductor Packaging 103
Glass core Vs Organic core 104
Market Scale Forecast of Glass core FCBGA Substrates 107
Product Trends in Glass core FCBGA Substrates 108
Technology Trends in Glass core FCBGA Substrates（Specs of Substrates） 109
Technology Trends in Glass core FCBGA Substrates（Production Technology） 110
D-2 Glass interposer
Overview and Characteristics of Interposers for Advanced Semiconductor Packaging 113
Comparison of Characteristics of Various Interposers 114
Overview of Si Interposers 115
Overview of Organic Interposers 116
Market Scale Forecast of Glass Interposers 117
Product Trends in Glass Interposers 120
Technology Trends in Glass Interposers（Specs of Interposers） 121
Technology Trends in Glass Interposers（Production Technology） 122
E: Related Materials
E-1: Plane Glass Board 126
E-2: Plating solutions 138
E-3: Insulation layer materials 152
F: Related Machines
F-1: Exposure machine 163
F-2: Laset drill machine 172
F-3: CMP machine 181
